EP 3306226 A1 20180411 - HEAT PUMP DEVICE
Title (en)
HEAT PUMP DEVICE
Title (de)
WÄRMEPUMPENVORRICHTUNG
Title (fr)
DISPOSITIF DE POMPE À CHALEUR
Publication
Application
Priority
- JP 2015108184 A 20150528
- JP 2016002319 W 20160512
Abstract (en)
A heat pump device of the present invention includes a first refrigeration circuit, a second refrigeration circuit, and a controller. The first refrigeration circuit includes a first compressor, a first condenser, a first throttle tool, and a first evaporator connected in a ring and lets a first refrigerant circulate. The second refrigeration circuit lets a second refrigerant circulate and exchanges heat with the first refrigeration circuit via the first evaporator. The controller has a first refrigeration circuit low-pressure suppression mode in which the controller reduces a flow rate of the second refrigerant circulating in the second refrigeration circuit and reduces an opening level of the first throttle such that pressure at a low pressure side of the first refrigeration circuit falls to or below a predetermined value. This configuration provides a heat pump device that prevents a rise in pressure at a low pressure side of a refrigeration cycle for hot-water supply.
IPC 8 full level
CPC (source: EP)
F25B 1/00 (2013.01); F25B 7/00 (2013.01); F25B 9/008 (2013.01); F25B 13/00 (2013.01); F25B 2313/021 (2013.01); F25B 2313/0231 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3306226 A1 20180411; EP 3306226 A4 20180620; JP 6695033 B2 20200520; JP WO2016189810 A1 20180315; WO 2016189810 A1 20161201
DOCDB simple family (application)
EP 16799525 A 20160512; JP 2016002319 W 20160512; JP 2017520214 A 20160512