EP 3311407 A1 20180425 - HEAT SINK FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAID HEAT SINK
Title (en)
HEAT SINK FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAID HEAT SINK
Title (de)
KÜHLKÖRPER FÜR EINE ELEKTRONISCHE KOMPONENTE UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
DISSIPATEUR THERMIQUE POUR UN COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102015215570 A 20150814
- EP 2016066302 W 20160708
Abstract (en)
[origin: WO2017029029A1] The invention relates to a heat sink (14) for an electronic component (12). The invention further relates to a method for producing such a heat sink. According to the invention, cooling chimneys (23) that open at the top are provided in the heat sink (14). Said cooling chimneys (23) are supplied with cooling air by cooling channels (21) (formed, for example, by an open-pore material having pores (19)), wherein said cooling air advantageously contributes to effective cooling of the electronic component (12). According to the invention, the air movement is produced by the stack effect in the cooling chimneys (23), and therefore no active components must be installed in the heat sink. The heat sink (14) can be produced, for example, by additive manufacturing methods, such as laser melting or laser sintering.
IPC 8 full level
H01L 23/373 (2006.01); H01L 23/467 (2006.01)
CPC (source: EP US)
H01L 23/3733 (2013.01 - EP US); H01L 23/3736 (2013.01 - EP US); H05K 7/2039 (2013.01 - US); H05K 7/209 (2013.01 - US); H01L 23/467 (2013.01 - EP US); H05K 1/0203 (2013.01 - US)
Citation (search report)
See references of WO 2017029029A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015215570 A1 20170216; CN 107924891 A 20180417; CN 107924891 B 20210115; EP 3311407 A1 20180425; JP 2018525828 A 20180906; JP 6623284 B2 20191218; US 10582642 B2 20200303; US 2018235101 A1 20180816; WO 2017029029 A1 20170223
DOCDB simple family (application)
DE 102015215570 A 20150814; CN 201680047415 A 20160708; EP 16741270 A 20160708; EP 2016066302 W 20160708; JP 2018507490 A 20160708; US 201615751243 A 20160708