EP 3312308 A1 20180425 - NICKEL PLATING SOLUTION
Title (en)
NICKEL PLATING SOLUTION
Title (de)
NICKELPLATTIERUNGSLÖSUNG
Title (fr)
SOLUTION DE PLACAGE DE NICKEL
Publication
Application
Priority
JP 2016208151 A 20161024
Abstract (en)
The present invention relates to a boric-acid free nickel plating composition which does not include organic carboxylic acid but has high bath-pH-stability. The nickel plating composition provides a nickel plating film suitable for the use of electronic components.
IPC 8 full level
CPC (source: CN EP KR US)
C25D 3/12 (2013.01 - CN EP KR US); C25D 7/123 (2013.01 - CN EP KR US)
Citation (applicant)
- JP 2012126951 A 20120705 - MELTEX INC
- JP 2004265253 A 20040924 - MATSUSHITA ELECTRIC WORKS LTD
- JP 2001172790 A 20010626 - TOKYO METROPOLITAN GOV
- JP 2010267208 A 20101125 - IRF KK, et al
Citation (search report)
- [X] JP 2008285732 A 20081127 - MELTEX INC
- [XDI] JP 2012126951 A 20120705 - MELTEX INC
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3312308 A1 20180425; CN 107974698 A 20180501; JP 2018070907 A 20180510; KR 20180044824 A 20180503; TW 201816191 A 20180501; US 2018112319 A1 20180426
DOCDB simple family (application)
EP 17197736 A 20171023; CN 201710963553 A 20171017; JP 2016208151 A 20161024; KR 20170137321 A 20171023; TW 106134778 A 20171011; US 201715692521 A 20170831