Global Patent Index - EP 3317042 A1

EP 3317042 A1 20180509 - PART, AND FILLING OF A DEFECTIVE SPOT BY MEANS OF ALTERNATIVE SOLDER AND PARENT METAL LAYERS

Title (en)

PART, AND FILLING OF A DEFECTIVE SPOT BY MEANS OF ALTERNATIVE SOLDER AND PARENT METAL LAYERS

Title (de)

BAUTEIL UND AUFFÜLLUNG EINER FEHLSTELLE MITTELS ALTERNATIVEN LOT- UND GRUNDWERKSTOFFSCHICHTEN

Title (fr)

PIÈCE ET COMBLEMENT D'UNE ZONE DÉFECTUEUSE AU MOYEN DE COUCHES ALTERNÉES DE BRASURE ET DE MATÉRIAU DE BASE

Publication

EP 3317042 A1 20180509 (DE)

Application

EP 16766275 A 20160912

Priority

  • DE 102015219345 A 20151007
  • EP 2016071401 W 20160912

Abstract (en)

[origin: WO2017060044A1] The invention relates to a part and to the filling, layer by layer, of a defective spot by means of solder and parent metal. Since a defective spot is filled layer by layer (10', 11', ...), good mechanical properties are obtained for the defective spot (4) and the entire part (1).

IPC 8 full level

B23K 26/342 (2014.01); B23K 1/00 (2006.01); B23K 9/04 (2006.01); B23K 26/144 (2014.01); B23K 35/30 (2006.01); B23P 6/00 (2006.01); F01D 5/00 (2006.01)

CPC (source: EP US)

B23K 1/0018 (2013.01 - EP); B23K 9/044 (2013.01 - EP); B23K 26/144 (2015.10 - EP US); B23K 26/342 (2015.10 - EP US); B23K 35/3033 (2013.01 - EP); B23P 6/007 (2013.01 - EP US); F01D 5/00 (2013.01 - EP); F01D 5/005 (2013.01 - EP US); F05D 2230/232 (2013.01 - EP); F05D 2230/234 (2013.01 - EP US); F05D 2230/237 (2013.01 - EP); F05D 2230/238 (2013.01 - EP); F05D 2230/30 (2013.01 - EP US)

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2017060044 A1 20170413; DE 102015219345 A1 20170413; EP 3317042 A1 20180509; US 2020164465 A1 20200528

DOCDB simple family (application)

EP 2016071401 W 20160912; DE 102015219345 A 20151007; EP 16766275 A 20160912; US 201615765519 A 20160912