EP 3320694 A1 20180516 - MEMS CIRCUIT BOARD MODULE HAVING AN INTEGRATED PIEZOELECTRIC STRUCTURE, AND ELECTROACOUSTIC TRANSDUCER ARRANGEMENT
Title (en)
MEMS CIRCUIT BOARD MODULE HAVING AN INTEGRATED PIEZOELECTRIC STRUCTURE, AND ELECTROACOUSTIC TRANSDUCER ARRANGEMENT
Title (de)
MEMS-LEITERPLATTENMODUL MIT INTEGRIERTER PIEZOELEKTRISCHER STRUKTUR SOWIE SCHALLWANDLERANORDNUNG
Title (fr)
MODULE À CARTE DE CIRCUIT IMPRIMÉ MEMS À STRUCTURE PIÉZOÉLECTRIQUE INTÉGRÉE ET ENSEMBLE TRANSDUCTEUR ACOUSTIQUE
Publication
Application
Priority
- DE 102015116640 A 20151001
- EP 2016070796 W 20160905
Abstract (en)
[origin: WO2017055012A1] The invention relates to a MEMS circuit board module (1) for an electroacoustic transducer arrangement (2) for generating and/or detecting sound waves in the audible wavelength spectrum, comprising a circuit board (4) and a multilayer piezoelectric structure (5) that allows a membrane (6), which is provided for this purpose, to vibrate and/or detects vibrations of the membrane (6). According to the invention, the multilayer piezoelectric structure (5) is connected directly to the circuit board (4). The invention further relates to an electroacoustic transducer arrangement (2) comprising a MEMS circuit board module (1) of this type as well as to a method for manufacturing the MEMS circuit board module (1) and the electroacoustic transducer arrangement (2).
IPC 8 full level
H04R 7/10 (2006.01); H04R 17/00 (2006.01)
CPC (source: EP KR US)
H04R 3/00 (2013.01 - US); H04R 7/10 (2013.01 - EP KR US); H04R 17/00 (2013.01 - EP KR US); H04R 19/005 (2013.01 - US); H04R 2201/003 (2013.01 - EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2017055012 A1 20170406; AU 2016332481 A1 20180412; AU 2016332481 B2 20200716; CA 2997567 A1 20170406; CN 108141669 A 20180608; CN 108141669 B 20210122; DE 102015116640 A1 20170406; DE 102015116640 B4 20240905; EP 3320694 A1 20180516; EP 3320694 B1 20191113; HK 1250192 A1 20181130; KR 20180061187 A 20180607; SG 10202002939Q A 20200528; SG 11201802051U A 20180427; US 10433063 B2 20191001; US 2018249252 A1 20180830
DOCDB simple family (application)
EP 2016070796 W 20160905; AU 2016332481 A 20160905; CA 2997567 A 20160905; CN 201680057170 A 20160905; DE 102015116640 A 20151001; EP 16760706 A 20160905; HK 18109454 A 20180720; KR 20187008583 A 20160905; SG 10202002939Q A 20160905; SG 11201802051U A 20160905; US 201615758070 A 20160905