EP 3322264 A1 20180516 - HIGH FREQUENCY MODULE
Title (en)
HIGH FREQUENCY MODULE
Title (de)
HOCHFREQUENZMODUL
Title (fr)
MODULE À HAUTE FRÉQUENCE
Publication
Application
Priority
- JP 2015137056 A 20150708
- JP 2016063208 W 20160427
Abstract (en)
[Object] To provide a high-frequency module that has a simple structure and that contributes to size reduction of a device. [Solution] A high-frequency module 100 includes a wiring substrate 10 and an antenna substrate 20 disposed on an upper surface of the wiring substrate 10, an antenna 21 is formed by a metal pattern 21a on the antenna substrate 20, a non-conductive adhesive 11 and a conductive adhesive 13 are present between the wiring substrate 10 and the antenna substrate 20, and a spacer 23 is provided between the non-conductive adhesive 11 and the conductive adhesive 13. Thus, by the spacer 23, it is possible to prevent contact between the non-conductive adhesive 11 and the conductive adhesive 13 and it is also possible to ensure a required height between the wiring substrate 10 and the antenna substrate 20. In addition, it is possible to achieve connection between the wiring substrate 10 and the antenna substrate 20 by a simple structure.
IPC 8 full level
H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01)
CPC (source: EP US)
H01Q 1/2283 (2013.01 - EP US); H01Q 1/36 (2013.01 - EP US); H01Q 1/405 (2013.01 - EP US); H01Q 5/371 (2015.01 - EP US); H05K 1/0243 (2013.01 - US); H05K 1/144 (2013.01 - EP US); H05K 1/181 (2013.01 - US); H05K 3/321 (2013.01 - EP US); H01Q 1/2291 (2013.01 - EP US); H01Q 9/42 (2013.01 - EP US); H05K 1/185 (2013.01 - EP US); H05K 3/368 (2013.01 - EP US); H05K 2201/042 (2013.01 - EP US); H05K 2201/09909 (2013.01 - EP US); H05K 2201/10098 (2013.01 - EP US); H05K 2201/10522 (2013.01 - EP US); H05K 2201/10568 (2013.01 - EP US); H05K 2201/10636 (2013.01 - EP US); H05K 2201/2036 (2013.01 - EP US); H05K 2201/2081 (2013.01 - US); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3322264 A1 20180516; EP 3322264 A4 20190306; JP WO2017006614 A1 20180308; US 2018145397 A1 20180524; WO 2017006614 A1 20170112
DOCDB simple family (application)
EP 16821085 A 20160427; JP 2016063208 W 20160427; JP 2017527105 A 20160427; US 201815863269 A 20180105