EP 3332044 B1 20200101 - TIN/COPPER ALLOYS CONTAINING PALLADIUM, METHOD FOR THEIR PREPARATION AND USE THEREOF
Title (en)
TIN/COPPER ALLOYS CONTAINING PALLADIUM, METHOD FOR THEIR PREPARATION AND USE THEREOF
Title (de)
PALLADIUMHALTIGE ZINN-/KUPFERLEGIERUNGEN, VERFAHREN ZU DEREN HERSTELLUNG UND VERWENDUNG DAVON
Title (fr)
ALLIAGES D'ÉTAIN ET DE CUIVRE CONTENANT DU PALLADIUM, PROCÉDÉ POUR LEUR PRÉPARATION, ET UTILISATION ASSOCIÉE
Publication
Application
Priority
- IT UB20152876 A 20150805
- IB 2016054703 W 20160804
Abstract (en)
[origin: WO2017021916A2] Bronze alloys containing palladium are described, in which the palladium content is from 0.25 to 10% by weight calculated on the total weight of the alloy and the galvanic baths used for their production.
IPC 8 full level
C22C 9/02 (2006.01); C25D 3/58 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP)
C22C 9/02 (2013.01); C25D 3/58 (2013.01); C25D 7/005 (2013.01)
Citation (opposition)
Opponent : Coventya Holding SAS
- WO 2017021916 A2 20170209 - BLUCLAD S R L [IT]
- US 2014055026 A1 20140227 - HUTIN OLIVIER [DE], et al
- US 5972526 A 19991026 - MATSUMOTO YOSUKE [JP], et al
- JP H06293990 A 19941021 - NIPPON SHINKINZOKU KAKO KK
- WO 2015039152 A1 20150326 - W GARHÖFER GES M B H ING [AT]
- EP 2799595 A1 20141105 - DELPHI TECH INC [US]
- RICHARD E DEPOTO AND AL GRUENWALD C., UYEMURA & CO. LTD., & JOERG WEBER AND KLAUS LEYENDECKER, UMICORE GALVANOTECHNIK GMBH: "White Bronze, Copper-Tin-Zinc Tri-metal: Expand- ing Applications and New Developments in a Changing Landscape", ELECTROPLATING, 20 May 2013 (2013-05-20), pages 1 - 16, XP055739739, Retrieved from the Internet <URL:www.pfonline.com/articles/white-bronze-copper-tin-zi nc-tri-metal- ex panding-applications-and-new-developments-in-a-changing-landscape>
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2017021916 A2 20170209; WO 2017021916 A3 20170316; CN 108138263 A 20180608; EP 3332044 A2 20180613; EP 3332044 B1 20200101; HK 1253577 A1 20190621; IT UB20152876 A1 20170205
DOCDB simple family (application)
IB 2016054703 W 20160804; CN 201680045399 A 20160804; EP 16767356 A 20160804; HK 18112782 A 20181008; IT UB20152876 A 20150805