Global Patent Index - EP 3332420 A1

EP 3332420 A1 20180613 - COMPONENT MODULE AND POWER MODULE

Title (en)

COMPONENT MODULE AND POWER MODULE

Title (de)

BAUTEILMODUL UND LEISTUNGSMODUL

Title (fr)

MODULE DE COMPOSANT ET MODULE DE PUISSANCE

Publication

EP 3332420 A1 20180613 (DE)

Application

EP 16745482 A 20160802

Priority

  • DE 102015214928 A 20150805
  • EP 2016068394 W 20160802

Abstract (en)

[origin: WO2017021394A1] The disclosed component module includes a component comprising at least one electric contact to which at least one porous contact piece is connected; the component module further includes a cooling system for fluid-based cooling, said cooling system comprising one or more cooling ducts which are formed by pores of the porous contact piece. The disclosed power module comprises a component module of said type.

IPC 8 full level

H01L 23/373 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01)

CPC (source: EP US)

H01L 23/3733 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 23/3736 (2013.01 - EP US); H01L 23/427 (2013.01 - EP US); H01L 23/467 (2013.01 - EP US); H01L 24/29 (2013.01 - EP); H01L 24/37 (2013.01 - EP US); H01L 24/83 (2013.01 - EP); H01L 24/84 (2013.01 - EP); H01L 24/05 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 2224/04026 (2013.01 - EP); H01L 2224/04034 (2013.01 - EP); H01L 2224/05624 (2013.01 - EP); H01L 2224/05639 (2013.01 - EP); H01L 2224/05644 (2013.01 - EP); H01L 2224/13939 (2013.01 - US); H01L 2224/29211 (2013.01 - EP); H01L 2224/29224 (2013.01 - EP); H01L 2224/29239 (2013.01 - EP); H01L 2224/29244 (2013.01 - EP); H01L 2224/29247 (2013.01 - EP); H01L 2224/29255 (2013.01 - EP); H01L 2224/29266 (2013.01 - EP); H01L 2224/2929 (2013.01 - EP); H01L 2224/29398 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/37211 (2013.01 - EP US); H01L 2224/37224 (2013.01 - EP); H01L 2224/37239 (2013.01 - EP US); H01L 2224/37244 (2013.01 - EP US); H01L 2224/37247 (2013.01 - EP US); H01L 2224/37255 (2013.01 - EP US); H01L 2224/37266 (2013.01 - EP); H01L 2224/3729 (2013.01 - EP); H01L 2224/37395 (2013.01 - US); H01L 2224/83201 (2013.01 - EP); H01L 2224/83345 (2013.01 - EP); H01L 2224/83801 (2013.01 - EP); H01L 2224/8382 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP); H01L 2224/8385 (2013.01 - EP); H01L 2224/84345 (2013.01 - EP); H01L 2224/84801 (2013.01 - EP); H01L 2224/8482 (2013.01 - EP); H01L 2224/8484 (2013.01 - EP); H01L 2224/8485 (2013.01 - EP); H01L 2924/1203 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US)

Citation (search report)

See references of WO 2017021394A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2017021394 A1 20170209; CN 107851626 A 20180327; CN 107851626 B 20210813; DE 102015214928 A1 20170209; EP 3332420 A1 20180613; EP 3332420 B1 20201111; JP 2018528609 A 20180927; JP 6596570 B2 20191023; US 10741474 B2 20200811; US 2018301392 A1 20181018

DOCDB simple family (application)

EP 2016068394 W 20160802; CN 201680045964 A 20160802; DE 102015214928 A 20150805; EP 16745482 A 20160802; JP 2018504906 A 20160802; US 201615750150 A 20160802