EP 3333889 A4 20180815 - HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS
Title (en)
HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS
Title (de)
WÄRMEABLEITUNGSSTRUKTUR UND ELEKTRONISCHE VORRICHTUNG
Title (fr)
STRUCTURE DE DISSIPATION DE CHALEUR ET APPAREIL ÉLECTRONIQUE
Publication
Application
Priority
- JP 2015155419 A 20150805
- JP 2016003498 W 20160728
Abstract (en)
[origin: EP3333889A1] Provided is a heat radiation structure capable of reducing electromagnetic waves to be radiated from a heating component. The heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.
IPC 8 full level
H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); H01L 23/552 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/40 (2006.01)
CPC (source: EP US)
H01L 23/00 (2013.01 - EP US); H01L 23/3677 (2013.01 - US); H01L 23/42 (2013.01 - EP US); H01L 23/4334 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H05K 7/142 (2013.01 - EP US); H05K 7/20163 (2013.01 - US); H05K 7/20445 (2013.01 - EP US); H05K 7/20963 (2013.01 - US); H05K 9/00 (2013.01 - US); H05K 9/0054 (2013.01 - EP US); H01J 2217/492 (2013.01 - US); H01L 23/4006 (2013.01 - EP US); H01L 2023/4056 (2013.01 - EP US); H01L 2023/4068 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15151 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
- [X] US 9059127 B1 20150616 - LAMOREY MARK C [US], et al
- [Y] US 2002079593 A1 20020627 - HUANG CHIEN PING [TW]
- [Y] US 6933602 B1 20050823 - PATEL PRADIP [US], et al
- [A] US 2008137300 A1 20080612 - MACRIS CHRIS G [US], et al
- [A] US 5581443 A 19961203 - NAKAMURA HIROSHI [JP], et al
- [A] US 2011176279 A1 20110721 - ZHAO SAM ZIQUN [US], et al
- [A] US 2005068725 A1 20050331 - HOULE SABINA [US], et al
- See references of WO 2017022221A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3333889 A1 20180613; EP 3333889 A4 20180815; EP 3333889 B1 20220720; JP WO2017022221 A1 20180531; US 10244668 B2 20190326; US 2018199472 A1 20180712; WO 2017022221 A1 20170209
DOCDB simple family (application)
EP 16832504 A 20160728; JP 2016003498 W 20160728; JP 2017532372 A 20160728; US 201615745730 A 20160728