EP 3340929 A4 20190410 - IMPLANT DEVICE AND METHOD OF MAKING THE SAME
Title (en)
IMPLANT DEVICE AND METHOD OF MAKING THE SAME
Title (de)
IMPLANTATVORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
DISPOSITIF D'IMPLANT ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- US 201514838788 A 20150828
- US 2016049034 W 20160826
Abstract (en)
[origin: WO2017040302A1] The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
IPC 8 full level
A61F 2/14 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61N 1/375 (2006.01)
CPC (source: EP)
A61N 1/0543 (2013.01); A61N 1/375 (2013.01); A61N 1/3758 (2013.01); H01L 21/6835 (2013.01); H01L 23/49827 (2013.01); H01L 23/4985 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/76 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); A61F 2240/00 (2013.01); A61N 1/36046 (2013.01); H01L 21/565 (2013.01); H01L 23/15 (2013.01); H01L 23/49883 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/245 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75983 (2013.01); H01L 2224/76704 (2013.01); H01L 2224/76983 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/8285 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/83013 (2013.01); H01L 2224/83026 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83905 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/19107 (2013.01); H05K 1/189 (2013.01)
Citation (search report)
- [X] US 2009124965 A1 20090514 - GREENBERG ROBERT J [US], et al
- [X] US 2011118808 A1 20110519 - ROBERT J GREENBERG [US], et al
- [A] US 7211884 B1 20070501 - DAVIS DION F [US], et al
- See references of WO 2017040302A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2017040302 A1 20170309; CN 108024851 A 20180511; EP 3340929 A1 20180704; EP 3340929 A4 20190410
DOCDB simple family (application)
US 2016049034 W 20160826; CN 201680049872 A 20160826; EP 16842692 A 20160826