Global Patent Index - EP 3340929 A4

EP 3340929 A4 20190410 - IMPLANT DEVICE AND METHOD OF MAKING THE SAME

Title (en)

IMPLANT DEVICE AND METHOD OF MAKING THE SAME

Title (de)

IMPLANTATVORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG DAVON

Title (fr)

DISPOSITIF D'IMPLANT ET SON PROCÉDÉ DE FABRICATION

Publication

EP 3340929 A4 20190410 (EN)

Application

EP 16842692 A 20160826

Priority

  • US 201514838788 A 20150828
  • US 2016049034 W 20160826

Abstract (en)

[origin: WO2017040302A1] The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.

IPC 8 full level

A61F 2/14 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61N 1/375 (2006.01)

CPC (source: EP)

A61N 1/0543 (2013.01); A61N 1/375 (2013.01); A61N 1/3758 (2013.01); H01L 21/6835 (2013.01); H01L 23/49827 (2013.01); H01L 23/4985 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/76 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); A61F 2240/00 (2013.01); A61N 1/36046 (2013.01); H01L 21/565 (2013.01); H01L 23/15 (2013.01); H01L 23/49883 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/245 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75983 (2013.01); H01L 2224/76704 (2013.01); H01L 2224/76983 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/8285 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/83013 (2013.01); H01L 2224/83026 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83905 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/19107 (2013.01); H05K 1/189 (2013.01)

C-Set (source: EP)

  1. H01L 2224/82106 + H01L 2924/00012
  2. H01L 2224/73217 + H01L 2924/00012
  3. H01L 2224/8285 + H01L 2924/0781
  4. H01L 2224/245 + H01L 2924/0665 + H01L 2924/0781
  5. H01L 2224/27416 + H01L 2924/00014
  6. H01L 2224/83009 + H01L 2924/00012
  7. H01L 2224/83905 + H01L 2224/83026 + H01L 2224/83013
  8. H01L 2224/83203 + H01L 2924/00012
  9. H01L 2224/8321 + H01L 2924/00014
  10. H01L 2224/2919 + H01L 2924/0665
  11. H01L 2224/2919 + H01L 2924/0665 + H01L 2924/07802
  12. H01L 2224/131 + H01L 2924/014

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2017040302 A1 20170309; CN 108024851 A 20180511; EP 3340929 A1 20180704; EP 3340929 A4 20190410

DOCDB simple family (application)

US 2016049034 W 20160826; CN 201680049872 A 20160826; EP 16842692 A 20160826