EP 3348659 B1 20201223 - COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTICALLY-WORKED MATERIAL FOR ELECTRONIC/ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, AND BUSBAR
Title (en)
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTICALLY-WORKED MATERIAL FOR ELECTRONIC/ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, AND BUSBAR
Title (de)
KUPFERLEGIERUNG FÜR ELEKTRONISCHE/ELEKTRISCHE VORRICHTUNG, PLASTISCH BEARBEITETES KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRONISCHE/ELEKTRISCHE VORRICHTUNG, KOMPONENTE FÜR ELEKTRONISCHE/ELEKTRISCHE VORRICHTUNG, ENDGERÄT UND SAMMELSCHIENE
Title (fr)
ALLIAGE DE CUIVRE POUR DISPOSITIF ÉLECTRONIQUE/ÉLECTRIQUE, MATÉRIAU EN ALLIAGE DE CUIVRE TRAVAILLÉ PLASTIQUEMENT POUR DISPOSITIF ÉLECTRONIQUE/ÉLECTRIQUE, COMPOSANT POUR DISPOSITIF ÉLECTRONIQUE/ÉLECTRIQUE, BORNE ET BARRE OMNIBUS
Publication
Application
Priority
- JP 2015177743 A 20150909
- JP 2015235096 A 20151201
- JP 2016069178 A 20160330
- JP 2016076456 W 20160908
Abstract (en)
[origin: EP3348659A1] A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass% or more and less than 0.35 mass%; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75%IACS, and a strength ratio TS TD /TS LD , which is calculated from strength TS TD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TS LD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass% or more and less than 0.01 mass%.
IPC 8 full level
C22C 9/00 (2006.01); B32B 15/01 (2006.01); H01B 1/02 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP KR US)
B32B 15/018 (2013.01 - EP US); B32B 15/20 (2013.01 - US); C22C 9/00 (2013.01 - EP KR US); C22F 1/08 (2013.01 - KR); H01B 1/02 (2013.01 - EP US); H01B 1/026 (2013.01 - EP KR US); H01B 5/02 (2013.01 - EP KR US); H01R 4/58 (2013.01 - US); C22F 1/08 (2013.01 - EP US); Y10T 428/12431 (2015.01 - US); Y10T 428/12903 (2015.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3348659 A1 20180718; EP 3348659 A4 20190522; EP 3348659 B1 20201223; CN 107636179 A 20180126; CN 107636179 B 20200616; KR 102474714 B1 20221205; KR 20180043198 A 20180427; MX 2018001139 A 20180420; MY 196265 A 20230324; PH 12017502293 A1 20180611; SG 11201710361S A 20180328; TW 201726931 A 20170801; TW I701351 B 20200811; US 10676803 B2 20200609; US 2018187292 A1 20180705; WO 2017043577 A1 20170316
DOCDB simple family (application)
EP 16844438 A 20160908; CN 201680032194 A 20160908; JP 2016076456 W 20160908; KR 20177030943 A 20160908; MX 2018001139 A 20160908; MY PI2017705078 A 20160908; PH 12017502293 A 20171213; SG 11201710361S A 20160908; TW 105129154 A 20160908; US 201615741148 A 20160908