EP 3353824 A1 20180801 - COOLING ARRANGEMENT FOR AN ELECTRONIC COMPONENT
Title (en)
COOLING ARRANGEMENT FOR AN ELECTRONIC COMPONENT
Title (de)
KÜHLANORDNUNG FÜR EINE ELEKTRONISCHE KOMPONENTE
Title (fr)
DISPOSITIF DE REFROIDISSEMENT POUR UN COMPOSANT ÉLECTRONIQUE
Publication
Application
Priority
- DE 102015218083 A 20150921
- EP 2016071036 W 20160907
Abstract (en)
[origin: WO2017050570A1] The invention relates to a cooling arrangement for an electronic component (11) or an electrical assembly having such a cooling arrangement. Said cooling arrangement has a passive heat sink (13) for cooling an electrical device (11). According to the invention, there is additionally provision for transducers (14), e.g. thermoelectric generators, to cause an additional cooling effect by dissipating heat from the electronic device (11) and at the same time to allow the generation of power. This can be used, by way of example, to drive an active cooling apparatus (23), such as a piezo fan (38), which additionally caters for cooling the heat sink (13) and hence improves the cooling effect. The overall system is self-sufficient in terms of energy, since the requisite power supply is obtained from the waste heat from the electronic device (11). Advantageously, the power obtained can also be made available to other functional elements. The added costs of the additional cooling are therefore compensated for by saving on an energy source.
IPC 8 full level
H10N 10/10 (2023.01); H10N 10/13 (2023.01); H01L 23/38 (2006.01); H01L 23/467 (2006.01)
CPC (source: EP US)
F04D 25/06 (2013.01 - US); F04D 33/00 (2013.01 - US); H01L 23/38 (2013.01 - EP US); H02H 5/04 (2013.01 - US); H05K 1/0203 (2013.01 - US); H10N 10/10 (2023.02 - EP US); H10N 10/13 (2023.02 - EP US); H01L 23/467 (2013.01 - EP US); H05K 2201/064 (2013.01 - US); H05K 2201/066 (2013.01 - US); H05K 2201/10037 (2013.01 - US); H05K 2201/10151 (2013.01 - US); H05K 2201/10219 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015218083 A1 20170323; CN 108140711 A 20180608; EP 3353824 A1 20180801; US 2018269371 A1 20180920; WO 2017050570 A1 20170330
DOCDB simple family (application)
DE 102015218083 A 20150921; CN 201680061052 A 20160907; EP 16766262 A 20160907; EP 2016071036 W 20160907; US 201615761485 A 20160907