EP 3360988 B1 20190626 - PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL ALLOY PLATING BATHS CONTAINING SAID PYRIDINIUM COMPOUNDS AND A METHOD FOR USE OF SAID METAL OR METAL ALLOY PLATING BATHS
Title (en)
PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL ALLOY PLATING BATHS CONTAINING SAID PYRIDINIUM COMPOUNDS AND A METHOD FOR USE OF SAID METAL OR METAL ALLOY PLATING BATHS
Title (de)
PYRIDINIUMVERBINDUNGEN, EIN SYNTHESEVERFAHREN DAFÜR, METALL- ODER METALLLEGIERUNGSPLATTIERUNGSBÄDER MIT BESAGTEN PYRIDINIUMVERBINDUNGEN UND VERFAHREN ZUR VERWENDUNG BESAGTER METALL- ODER METALLLEGIERUNGSPLATTIERUNGSBÄDER
Title (fr)
COMPOSÉS DE PYRIDINIUM, PROCÉDÉ DE SYNTHÈSE ASSOCIÉ, BAINS DE PLACAGE MÉTALLIQUE OU D'ALLIAGE MÉTALLIQUE CONTENANT LESDITS COMPOSÉS DE PYRIDINIUM ET PROCÉDÉ D'UTILISATION DESDITS BAINS DE PLACAGE MÉTALLIQUE OU D'ALLIAGE MÉTALLIQUE
Publication
Application
Priority
EP 17155408 A 20170209
Abstract (en)
[origin: EP3360988A1] The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths. The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.
IPC 8 full level
C25D 7/12 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); C25D 3/58 (2006.01)
CPC (source: EP KR US)
C07D 213/04 (2013.01 - KR); C07D 401/12 (2013.01 - KR US); C08G 73/0627 (2013.01 - KR); C25D 3/38 (2013.01 - EP KR US); C25D 3/58 (2013.01 - KR US); C25D 7/00 (2013.01 - EP KR US); C25D 7/123 (2013.01 - EP KR US); C25D 3/58 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3360988 A1 20180815; EP 3360988 B1 20190626; CN 110268101 A 20190920; CN 110268101 B 20220325; JP 2020508396 A 20200319; JP 6997199 B2 20220117; KR 102163537 B1 20201012; KR 20190113871 A 20191008; TW 201835047 A 20181001; TW I683806 B 20200201; US 10882842 B2 20210105; US 2020231565 A1 20200723; WO 2018145919 A1 20180816
DOCDB simple family (application)
EP 17155408 A 20170209; CN 201880010734 A 20180126; EP 2018051926 W 20180126; JP 2019542997 A 20180126; KR 20197025320 A 20180126; TW 107104657 A 20180209; US 201816483053 A 20180126