EP 3366387 B1 20220928 - METHOD AND DEVICE FOR PREPARING SEMI-SOLID SLURRY
Title (en)
METHOD AND DEVICE FOR PREPARING SEMI-SOLID SLURRY
Title (de)
VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON HALBFESTER SCHLÄMME
Title (fr)
PROCÉDÉ ET DISPOSITIF DE PRÉPARATION DE COULIS SEMI-SOLIDE
Publication
Application
Priority
- CN 201510873950 A 20151202
- CN 2016105099 W 20161108
Abstract (en)
[origin: US2018141112A1] A method for preparing semisolid slurry. The method is achieved using a device for preparing semisolid slurry. The device includes a slurry vessel and a mechanical stirring rod. The mechanical stirring rod includes a first end and a second end extending into the slurry vessel. The method includes: S1. putting a molten alloy having a first preset temperature into the slurry vessel; S2. cooling the molten alloy to a second preset temperature, positioning the second end of the mechanical stirring rod to be 5-25 mm higher than the bottom wall of the slurry vessel, rotating the mechanical stirring rod and injecting a cooling medium into the mechanical stirring rod; and S3: allowing the temperature of the molten alloy to be 10-90 degrees centigrade lower than the liquidus temperature of the molten alloy, stopping stirring and cooling, to yield a semisolid slurry.
IPC 8 full level
B22D 1/00 (2006.01); B22D 17/00 (2006.01)
CPC (source: CN EP KR US)
B01F 27/0531 (2022.01 - EP KR US); B01F 27/1125 (2022.01 - KR US); B01F 27/2122 (2022.01 - US); B01F 27/2124 (2022.01 - KR US); B01F 27/90 (2022.01 - EP US); B01F 35/2115 (2022.01 - EP KR US); B01F 35/2215 (2022.01 - KR US); B01F 35/91 (2022.01 - KR); B01F 35/93 (2022.01 - KR US); B01F 35/95 (2022.01 - EP KR US); B22D 1/00 (2013.01 - CN EP KR US); B22D 17/007 (2013.01 - CN EP KR US); B22D 21/04 (2013.01 - EP KR US); B01F 35/91 (2022.01 - US); B01F 2035/98 (2022.01 - EP US); B01F 2101/26 (2022.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 11059094 B2 20210713; US 2018141112 A1 20180524; CN 105328143 A 20160217; CN 105328143 B 20170613; EP 3366387 A1 20180829; EP 3366387 A4 20190626; EP 3366387 B1 20220928; JP 2018536544 A 20181213; JP 6621547 B2 20191218; KR 102071164 B1 20200302; KR 20180090850 A 20180813; WO 2017092551 A1 20170608
DOCDB simple family (application)
US 201815874861 A 20180118; CN 201510873950 A 20151202; CN 2016105099 W 20161108; EP 16869861 A 20161108; JP 2018548258 A 20161108; KR 20187018848 A 20161108