EP 3371824 A1 20180912 - METHOD FOR BONDING AND RELEASING SUBSTRATES
Title (en)
METHOD FOR BONDING AND RELEASING SUBSTRATES
Title (de)
VERFAHREN ZUM BONDEN UND LÖSEN VON SUBSTRATEN
Title (fr)
PROCÉDÉ DE LIAISON ET DE DÉTACHEMENT DE SUBSTRATS
Publication
Application
Priority
- DE 102015118742 A 20151102
- EP 2016075571 W 20161024
Abstract (en)
[origin: WO2017076682A1] The invention relates to a method for bonding a product substrate (2) with a connection layer (4) to a support substrate (5) and to a method for releasing the product substrate from the support substrate. A release layer (3) is applied between the connection layer (4) and the product substrate (2), wherein • a) the release layer (3) can be released by interacting with an electromagnetic radiation of a radiation source, and • b) the connection layer (4) and the support substrate (5) is each at least largely transparent to the electromagnetic radiation. The invention further relates to a corresponding product substrate/support substrate composite.
IPC 8 full level
H01L 21/683 (2006.01)
CPC (source: EP KR US)
H01L 21/6835 (2013.01 - EP KR US); H01L 24/94 (2013.01 - KR US); H01L 24/98 (2013.01 - KR US); B32B 7/023 (2019.01 - US); B32B 7/10 (2013.01 - US); B32B 7/12 (2013.01 - US); B32B 9/045 (2013.01 - US); B32B 38/10 (2013.01 - US); B32B 43/006 (2013.01 - US); H01L 2221/68318 (2013.01 - EP KR US); H01L 2221/68381 (2013.01 - EP KR US); H01L 2224/98 (2013.01 - US); Y10T 156/1158 (2015.01 - EP US); Y10T 156/1917 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015118742 A1 20170504; CN 108352351 A 20180731; CN 108352351 B 20230331; EP 3371824 A1 20180912; JP 2019501790 A 20190124; JP 2023027211 A 20230301; JP 2024084824 A 20240625; JP 7193339 B2 20221220; JP 7469444 B2 20240416; KR 102653627 B1 20240401; KR 20180075477 A 20180704; KR 20240046616 A 20240409; SG 11201802663U A 20180427; TW 201727713 A 20170801; TW 202320140 A 20230516; TW 202401529 A 20240101; TW I797064 B 20230401; TW I844173 B 20240601; US 10468286 B2 20191105; US 11024530 B2 20210601; US 2018233394 A1 20180816; US 2020013663 A1 20200109; WO 2017076682 A1 20170511
DOCDB simple family (application)
DE 102015118742 A 20151102; CN 201680056505 A 20161024; EP 16790304 A 20161024; EP 2016075571 W 20161024; JP 2018516437 A 20161024; JP 2022196134 A 20221208; JP 2024060986 A 20240404; KR 20187005916 A 20161024; KR 20247010207 A 20161024; SG 11201802663U A 20161024; TW 105132320 A 20161006; TW 111144621 A 20161006; TW 112134822 A 20161006; US 201615749960 A 20161024; US 201916575493 A 20190919