Global Patent Index - EP 3375898 B1

EP 3375898 B1 20220511 - COPPER ALLOY MATERIAL

Title (en)

COPPER ALLOY MATERIAL

Title (de)

KUPFERLEGIERUNGSMATERIAL

Title (fr)

MATÉRIAU D'ALLIAGE DE CUIVRE

Publication

EP 3375898 B1 20220511 (EN)

Application

EP 16863936 A 20161011

Priority

  • JP 2015219852 A 20151109
  • JP 2016080125 W 20161011

Abstract (en)

[origin: EP3375898A1] A copper alloy material has a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; and a Cu balance including inevitable impurities, wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, and a standard deviation of the crystal grain sizes is 0.6 or less.

IPC 8 full level

C22C 9/00 (2006.01); B22C 9/06 (2006.01); C22C 9/01 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP KR US)

B22C 9/061 (2013.01 - US); C22C 9/00 (2013.01 - EP KR US); C22C 9/01 (2013.01 - EP KR US); C22F 1/08 (2013.01 - EP KR US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3375898 A1 20180919; EP 3375898 A4 20190403; EP 3375898 B1 20220511; CN 108350530 A 20180731; JP 2017088949 A 20170525; JP 6693092 B2 20200513; KR 20180078245 A 20180709; US 2019062874 A1 20190228; WO 2017081972 A1 20170518

DOCDB simple family (application)

EP 16863936 A 20161011; CN 201680065499 A 20161011; JP 2015219852 A 20151109; JP 2016080125 W 20161011; KR 20187012111 A 20161011; US 201615771847 A 20161011