EP 3378093 A1 20180926 - WAFER BOAT AND PLASMA TREATMENT DEVICE FOR WAFERS
Title (en)
WAFER BOAT AND PLASMA TREATMENT DEVICE FOR WAFERS
Title (de)
WAFERBOOT UND PLASMA-BEHANDLUNGSVORRICHTUNG FÜR WAFER
Title (fr)
PORTE-PLAQUETTES ET DISPOSITIF DE TRAITEMENT PAR PLASMA DE PLAQUETTES
Publication
Application
Priority
- DE 102015014903 A 20151118
- EP 2016077985 W 20161117
Abstract (en)
[origin: WO2017085178A1] The invention relates to a plate element for a wafer boat for the plasma treatment of disk-shaped wafers, in particular semiconductor wafers for semiconductor or photovoltaic applications. The plate element is electrically conductive and has at least one holding unit on each side, for holding a wafer in a wafer holding region. The plate element has at least one recess in at least one side of the plate element and/or at least one opening in the plate element, wherein the at least one recess and/or the at least one opening in the plate element lies at least partially radially outside of the wafer holding region and directly adjacent thereto. The invention further relates to a wafer boat that has a plurality of plate elements of the above type arranged parallel to each other, wherein plate elements arranged adjacent are electrically insulated from each other. The invention further relates to a wafer boat in combination with a plasma treatment device, which has a process chamber for accommodating the wafer boat, means for controlling a process gas atmosphere in the process chamber in an open-loop or closed-loop manner, and at least one voltage source, which can be connected to the electrically conductive plate elements of the wafer boat in a suitable manner in order to apply a voltage between directly adjacent wafers held in the wafer boat.
IPC 8 full level
C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP KR US)
C23C 16/345 (2013.01 - US); C23C 16/4587 (2013.01 - EP KR US); C23C 16/505 (2013.01 - EP KR US); H01J 37/32449 (2013.01 - EP US); H01J 37/32715 (2013.01 - EP KR US); H01J 37/32733 (2013.01 - EP KR US); H01J 37/32908 (2013.01 - EP KR US); H01J 37/3299 (2013.01 - EP KR US); H01L 21/67313 (2013.01 - EP KR US); H01L 21/67754 (2013.01 - EP KR US); H01L 21/68771 (2013.01 - EP KR US); H01L 31/1876 (2013.01 - US); H01J 2237/332 (2013.01 - US); Y02E 10/50 (2013.01 - EP)
Citation (search report)
See references of WO 2017085178A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015014903 A1 20170518; CN 108475653 A 20180831; EP 3378093 A1 20180926; KR 20180084926 A 20180725; TW 201724326 A 20170701; TW I716491 B 20210121; US 2018337079 A1 20181122; WO 2017085178 A1 20170526
DOCDB simple family (application)
DE 102015014903 A 20151118; CN 201680079220 A 20161117; EP 16797907 A 20161117; EP 2016077985 W 20161117; KR 20187017131 A 20161117; TW 105137597 A 20161117; US 201615777299 A 20161117