Global Patent Index - EP 3380334 B1

EP 3380334 B1 20220727 - EMBOSSING METHOD FOR EMBOSSING MICROSTRUCTURES OR NANOSTRUCTURES

Title (en)

EMBOSSING METHOD FOR EMBOSSING MICROSTRUCTURES OR NANOSTRUCTURES

Title (de)

PRÄGEVERFAHREN ZUM PRÄGEN VON MIKRO- ODER NANOSTRUKTUREN

Title (fr)

PROCÉDÉ D'ESTAMPAGE DE MICROSTRUCTURES OU DE NANOSTRUCTURES

Publication

EP 3380334 B1 20220727 (DE)

Application

EP 16798626 A 20161118

Priority

  • DE 102015015407 A 20151127
  • EP 2016001922 W 20161118

Abstract (en)

[origin: WO2017088964A2] The invention relates to a method for embossing structures with dimensions in the micrometer or nanometer range in a layer of varnish. The layer of varnish is applied to one side of a film web and can be hardened by means of ultraviolet radiation. The film web is located in the conveying direction initially on one side, on which the layer of varnish which is yet to harden is applied, pressed through a presser on a embossing cylinder on which surface the structures which are to be stamped in the micrometer or nanometer region are arranged. This forms the structures in the micrometer range or in the nanometer range in the layer of varnish. Subsequently, the layer of varnish is hardened by ultraviolet radiation of a source for ultraviolet radiation. According to the invention, the film web is guided to the stamping cylinder from above or at least obliquely from above.

IPC 8 full level

B42D 25/328 (2014.01); B42D 25/324 (2014.01); B42D 25/355 (2014.01); B42D 25/425 (2014.01); B44B 5/02 (2006.01); B44C 1/17 (2006.01); B44C 1/24 (2006.01)

CPC (source: CN EP)

B42D 25/324 (2014.10 - CN EP); B42D 25/328 (2014.10 - CN EP); B42D 25/355 (2014.10 - CN EP); B42D 25/425 (2014.10 - CN EP); B44B 5/02 (2013.01 - CN); B44B 5/024 (2013.01 - EP); B44B 5/026 (2013.01 - EP); B44C 1/17 (2013.01 - CN); B44C 1/24 (2013.01 - CN EP)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2017088964 A2 20170601; WO 2017088964 A3 20170720; CN 108472981 A 20180831; CN 108472981 B 20200519; CN 111497492 A 20200807; CN 111497492 B 20220308; DE 102015015407 A1 20170601; EP 3380334 A2 20181003; EP 3380334 B1 20220727; EP 3792072 A1 20210317; EP 3792073 A1 20210317; EP 3792073 B1 20240515

DOCDB simple family (application)

EP 2016001922 W 20161118; CN 201680079437 A 20161118; CN 202010122837 A 20161118; DE 102015015407 A 20151127; EP 16798626 A 20161118; EP 20020436 A 20161118; EP 20020437 A 20161118