EP 3391180 A1 20181024 - INTEGRATED CIRCUIT THERMAL THROTTLING WITH WORKLOAD ADAPTED THERMAL SENSOR MAXIMUM TEMPERATURE
Title (en)
INTEGRATED CIRCUIT THERMAL THROTTLING WITH WORKLOAD ADAPTED THERMAL SENSOR MAXIMUM TEMPERATURE
Title (de)
INTEGRIERTE SCHALTUNG ZUR THERMISCHEN DROSSELUNG MIT ARBEITSLASTANGEPASSTER HÖCHSTTEMPERATUR DES THERMOSENSORS
Title (fr)
LIMITATION THERMIQUE DE CIRCUIT INTÉGRÉ À UNE TEMPÉRATURE MAXIMALE DE CAPTEUR THERMIQUE ADAPTÉE À UNE CHARGE DE TRAVAIL
Publication
Application
Priority
- US 201514975356 A 20151218
- US 2016057025 W 20161014
Abstract (en)
[origin: WO2017105610A1] A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.
IPC 8 full level
CPC (source: EP US)
G06F 1/203 (2013.01 - EP US); G06F 1/206 (2013.01 - EP US); G06F 1/324 (2013.01 - EP US); Y02D 10/00 (2017.12 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2017105610 A1 20170622; CN 108292161 A 20180717; CN 108292161 B 20220719; EP 3391180 A1 20181024; EP 3391180 A4 20190807; EP 3391180 B1 20230419; US 10712789 B2 20200714; US 11320877 B2 20220503; US 2017177044 A1 20170622; US 2020401199 A1 20201224
DOCDB simple family (application)
US 2016057025 W 20161014; CN 201680069172 A 20161014; EP 16876222 A 20161014; US 201514975356 A 20151218; US 202016926402 A 20200710