EP 3394560 A1 20181031 - DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN LAYERS
Title (en)
DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN LAYERS
Title (de)
VORRICHTUNG UND VERFAHREN ZUR MESSUNG DER HÖHE IN GEGENWART VON DÜNNSCHICHTEN
Title (fr)
DISPOSITIF ET PROCEDE DE MESURE DE HAUTEUR EN PRESENCE DE COUCHES MINCES
Publication
Application
Priority
- FR 1563128 A 20151222
- EP 2016080005 W 20161207
Abstract (en)
[origin: WO2017108400A1] The present invention relates to a device for measuring heights and/or thicknesses on a measurement object (24) such as a wafer, comprising: (i) a first low-coherence interferometer arranged to combine, in a spectrometer (18), a reference optical beam (17) and a measurement optical beam (16) from reflections of said light on interfaces of the measurement object (24), so as to produce a band spectrum signal (41) with spectral modulation frequencies; (ii) movement means (21) for varying the relative optical length of the measurement (16) and reference (17) optical beams, and means for measuring position information representing said relative optical length; (iii) electronic and computing means (20) arranged to determine at least one spectral modulation frequency representing an optical path difference between the measurement optical beam (16) and the reference optical beam (17), and to determine, using said position information and said at least one spectral modulation frequency, at least one height and/or thickness on said measurement object (24); and (iv) second optical means for measuring distance and/or thickness (27) with a second measurement beam (28) incident on the measurement object (24) according to a second surface opposite the measurement beam (16). The invention also relates to a method implemented in said device.
IPC 8 full level
G01B 9/02 (2006.01); G01B 11/06 (2006.01)
CPC (source: EP US)
G01B 9/02021 (2013.01 - EP US); G01B 9/02027 (2013.01 - EP US); G01B 9/02044 (2013.01 - EP US); G01B 9/02057 (2013.01 - EP US); G01B 9/02065 (2013.01 - EP US); G01B 9/0209 (2013.01 - EP US); G01B 11/0675 (2013.01 - EP US); G01B 2210/44 (2013.01 - EP US); G01B 2210/48 (2013.01 - EP US); G01B 2290/35 (2013.01 - EP US)
Citation (search report)
See references of WO 2017108400A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
FR 3045813 A1 20170623; FR 3045813 B1 20200501; CN 108431545 A 20180821; EP 3394560 A1 20181031; KR 20180098255 A 20180903; TW 201728869 A 20170816; US 2018364028 A1 20181220; WO 2017108400 A1 20170629
DOCDB simple family (application)
FR 1563128 A 20151222; CN 201680074722 A 20161207; EP 16816597 A 20161207; EP 2016080005 W 20161207; KR 20187017326 A 20161207; TW 105141398 A 20161214; US 201616061268 A 20161207