EP 3394887 A4 20190710 - SOLID STATE DEVICE MINIATURIZATION
Title (en)
SOLID STATE DEVICE MINIATURIZATION
Title (de)
MINIATURISIERUNG VON FESTKÖRPERVORRICHTUNG
Title (fr)
MINIATURISATION DE DISPOSITIF À SEMI-CONDUCTEUR
Publication
Application
Priority
- US 201514978315 A 20151222
- US 2016063293 W 20161122
Abstract (en)
[origin: US2017179090A1] One or more example embodiments of miniaturized electric devices are disclosed. in some example embodiments, the electric device includes a first thin substrate layer and a second thin substrate layer positioned above the first thin substrate layer. The electric device further includes one or more components electrically coupled to the first thin substrate layer. An overmold compound is deposited covering the one or more components between the first thin substrate and the second thin substrate. The electric device further includes one or more through mold vias that electrically and communicatively connect the first thin substrate layer and the second thin substrate layer.
IPC 8 full level
G06F 1/16 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP US)
G06F 1/1658 (2013.01 - US); H01L 21/565 (2013.01 - US); H01L 21/76802 (2013.01 - US); H01L 21/76877 (2013.01 - US); H01L 23/3107 (2013.01 - US); H01L 23/481 (2013.01 - US); H01L 23/49833 (2013.01 - US); H01L 23/49838 (2013.01 - US); H01L 25/0652 (2013.01 - EP US); H01L 25/16 (2013.01 - EP US); H01L 25/162 (2013.01 - US); H01L 25/50 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/16227 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/1306 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1433 (2013.01 - EP US); H01L 2924/1434 (2013.01 - EP US); H01L 2924/1436 (2013.01 - EP US); H01L 2924/15313 (2013.01 - EP US); H01L 2924/15333 (2013.01 - EP US); H01L 2924/157 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
- [Y] WO 2015165068 A1 20151105 - INTEL CORP [US], et al
- [Y] US 8319338 B1 20121127 - BERRY CHRISTOPHER J [US], et al
- [A] US 2010073860 A1 20100325 - MORIAI TAKAKATSU [JP], et al
- See references of WO 2017112245A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2017179090 A1 20170622; US 9773764 B2 20170926; EP 3394887 A1 20181031; EP 3394887 A4 20190710; TW 201729370 A 20170816; TW I712125 B 20201201; US 2018138159 A1 20180517; WO 2017112245 A1 20170629
DOCDB simple family (application)
US 201514978315 A 20151222; EP 16879730 A 20161122; TW 105137841 A 20161118; US 2016063293 W 20161122; US 201715712641 A 20170922