Global Patent Index - EP 3399588 A1

EP 3399588 A1 20181107 - COMPOSITE SUBSTRATE FOR A WAVEGUIDE AND METHOD OF MANUFACTURING A COMPOSITE SUBSTRATE

Title (en)

COMPOSITE SUBSTRATE FOR A WAVEGUIDE AND METHOD OF MANUFACTURING A COMPOSITE SUBSTRATE

Title (de)

VERBUNDSUBSTRAT FÜR EINEN WELLENLEITER UND VERFAHREN ZUR HERSTELLUNG EINES VERBUNDSUBSTRATS

Title (fr)

SUBSTRAT COMPOSITE POUR UN GUIDE D'ONDES ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT COMPOSITE

Publication

EP 3399588 A1 20181107 (EN)

Application

EP 17169665 A 20170505

Priority

EP 17169665 A 20170505

Abstract (en)

Composite substrate for a waveguide for RF signals having a signal frequency, wherein said composite substrate comprises at least a first layer of dielectric material and a second layer of dielectric material, and at least one conductor layer of an electrically conductive material arranged between said first layer and said second layer, wherein a layer thickness of said at least one conductor layer is smaller than about 120 percent of a skin depth of said RF signals within said electrically conductive material of said conductor layer.

IPC 8 full level

H01P 3/08 (2006.01); H05K 1/02 (2006.01)

CPC (source: EP US)

H01P 3/081 (2013.01 - US); H01P 3/082 (2013.01 - EP US); H01P 11/003 (2013.01 - US)

Citation (search report)

  • [XI] EP 1988596 A1 20081105 - HONEYWELL INT INC [US]
  • [XI] US 2015282299 A1 20151001 - SHI HONG [US], et al
  • [XI] US 5568106 A 19961022 - FANG TA-MING [US], et al
  • [XI] ZHANG L ET AL: "Dispersion Characteristics of Multilayer Microstrip Lines with Thin Metal Ground", ANTENNAS AND PROPAGATION SOCIETY SYMPOSIUM, 2005. IEEE WASHINGTON, DC, JULY 3 - 8, 2005, PISCATAWAY, NJ : IEEE, US, vol. 2B, 3 July 2005 (2005-07-03), pages 642 - 645, XP010859755, ISBN: 978-0-7803-8883-3, DOI: 10.1109/APS.2005.1552094

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3399588 A1 20181107; EP 3399588 B1 20220622; CN 110731029 A 20200124; CN 110731029 B 20220802; US 11394097 B2 20220719; US 2020127357 A1 20200423; WO 2018202560 A1 20181108

DOCDB simple family (application)

EP 17169665 A 20170505; CN 201880038495 A 20180427; EP 2018060822 W 20180427; US 201816611056 A 20180427