Global Patent Index - EP 3407425 A1

EP 3407425 A1 20181128 - CONNECTION ASSEMBLY FOR POWER MODULE AND POWER COMPONENT

Title (en)

CONNECTION ASSEMBLY FOR POWER MODULE AND POWER COMPONENT

Title (de)

ANSCHLUSSMONTAGE FÜR POWER MODUL UND POWER COMPONENT

Title (fr)

ENSEMBLE DE CONNEXION POUR MODULE DE PUISSANCE ET COMPOSANTE DE PUISSANCE

Publication

EP 3407425 A1 20181128 (EN)

Application

EP 17305616 A 20170524

Priority

EP 17305616 A 20170524

Abstract (en)

A connection assembly (1) for electrically connecting a power semiconductor module and a power component, the connection assembly comprising: - a plate-shape female connector (20) comprising a through hole (21), - a plate-shape male connector (30) comprising a pin (31), the connectors being formed in electrically conductive material, wherein the cross-section of the pin extends along a main direction (d), and the through hole is shaped to receive the pin, thereby establishing electrical contact between at least one wall (32) of the pin extending along said main direction and one wall of the plate-shape female connector, and wherein at least one of the plate-shape female connector and the plate-shape male connector comprises a pressure component (40) adapted to apply a pressure on the pin against the plate-shape female connector (20) when the pin is received in the through hole.

IPC 8 full level

H01R 4/26 (2006.01); H01R 13/05 (2006.01); H01R 13/11 (2006.01); H01R 4/58 (2006.01); H01R 13/66 (2006.01)

CPC (source: EP)

H01R 4/26 (2013.01); H01R 13/055 (2013.01); H01R 13/113 (2013.01); H01R 4/58 (2013.01); H01R 12/58 (2013.01); H01R 12/7088 (2013.01); H01R 13/66 (2013.01)

Citation (applicant)

US 2012164865 A1 20120628 - BAYERER REINHOLD [DE]

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3407425 A1 20181128; EP 3407425 B1 20200422; CN 110622357 A 20191227; CN 110622357 B 20210112; JP 2020504435 A 20200206; JP 6827563 B2 20210210; WO 2018216473 A1 20181129

DOCDB simple family (application)

EP 17305616 A 20170524; CN 201880025158 A 20180501; JP 2018018022 W 20180501; JP 2019557984 A 20180501