EP 3412121 A4 20200122 - METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD
Title (en)
METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER EXTREM DÜNNEN FLEXIBLEN MEHRSCHICHTIGEN LEITERPLATTE UND FLEXIBLE MEHRSCHICHTIGE LEITERPLATTE
Title (fr)
PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE SOUPLE EXTRÊMEMENT MINCE, ET CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE SOUPLE
Publication
Application
Priority
FI 2016050062 W 20160201
Abstract (en)
[origin: WO2017134331A1] In the manufacturing method of a multilayer printed circuit board and in a multilayer printed circuit board of the invention, at least part from insulating, conductive or semi-conductive layers remaining inside the multilayer printed circuit board there are manufactured a printed circuit board by using a roll-to-roll manufacturing method for two or several semi-finished printed circuit boards. Between the conductive printed layers of a semi-finished printed circuit board it is possible to manufacture electric vias connecting these by printing. A flexible multilayer printed circuit board is manufactured by connecting at least two semi-finished printed circuit boards face to face so that the pure surfaces of the metal foils of the semi-finished printed circuit boards remain outermost. After this holes can be manufactured through the flexible multilayer printed circuit board, which are metal-plated to produce an electric via.
IPC 8 full level
H05K 1/11 (2006.01); B82Y 30/00 (2011.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H05K 3/4069 (2013.01); H05K 3/4623 (2013.01); H05K 3/4635 (2013.01); B82Y 30/00 (2013.01); H05K 2201/035 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1545 (2013.01)
Citation (search report)
- [XAI] US 2014054079 A1 20140227 - SHEN FU-YUN [CN], et al
- [A] US 2008250637 A1 20081016 - ZHANG JUN-QING [CN], et al
- [A] US 2002056192 A1 20020516 - SUWA TOKIHITO [JP], et al
- See references of WO 2017134331A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2017134331 A1 20170810; EP 3412121 A1 20181212; EP 3412121 A4 20200122
DOCDB simple family (application)
FI 2016050062 W 20160201; EP 16889178 A 20160201