EP 3415648 A1 20181219 - SINTERED BODY OF TiAl INTERMETALLIC COMPOUND AND METHOD FOR PRODUCING SINTERED BODY OF TiAl INTERMETALLIC COMPOUND
Title (en)
SINTERED BODY OF TiAl INTERMETALLIC COMPOUND AND METHOD FOR PRODUCING SINTERED BODY OF TiAl INTERMETALLIC COMPOUND
Title (de)
SINTERKÖRPER AUS EINER INTERMETALLISCHEN TIAL-VERBINDUNG UND VERFAHREN ZUR HERSTELLUNG EINES SINTERKÖRPERS AUS EINER INTERMETALLISCHEN TIAL-VERBINDUNG
Title (fr)
CORPS FRITTÉ DE COMPOSÉ INTERMÉTALLIQUE TiAl, ET PROCÉDÉ DE PRODUCTION DE CORPS FRITTÉ DE COMPOSÉ INTERMÉTALLIQUE TiAl
Publication
Application
Priority
- JP 2016075932 A 20160405
- JP 2017006390 W 20170221
Abstract (en)
The sintered density of a TiAl-based intermetallic sintered compact is improved. A method for producing a TiAl-based intermetallic sintered compact includes sintering TiAl-based powder to produce the TiAl-based intermetallic sintered compact, the TiAl-based powder containing a TiAl-based intermetallic compound in which Ti and Al are bonded and an additional metal. The additional metal is Ni, or Ni and Fe.
IPC 8 full level
C22C 1/04 (2006.01); B22F 1/10 (2022.01); B22F 3/02 (2006.01); B22F 3/10 (2006.01); C22C 1/00 (2006.01); C22C 14/00 (2006.01); C22C 21/00 (2006.01)
CPC (source: EP US)
B22F 1/10 (2022.01 - EP US); B22F 3/16 (2013.01 - US); B22F 3/225 (2013.01 - EP US); C22C 1/00 (2013.01 - EP US); C22C 1/0416 (2013.01 - EP US); C22C 1/0458 (2013.01 - EP US); C22C 1/047 (2023.01 - EP US); C22C 14/00 (2013.01 - EP US); C22C 21/00 (2013.01 - EP US); B22F 2301/052 (2013.01 - US); B22F 2301/205 (2013.01 - US); B22F 2301/40 (2013.01 - US); B22F 2304/10 (2013.01 - US); B22F 2998/10 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3415648 A1 20181219; EP 3415648 A4 20190417; CA 3017441 A1 20171012; CA 3017441 C 20211026; JP 2017186609 A 20171012; JP 6688662 B2 20200428; US 2019076928 A1 20190314; WO 2017175499 A1 20171012
DOCDB simple family (application)
EP 17778878 A 20170221; CA 3017441 A 20170221; JP 2016075932 A 20160405; JP 2017006390 W 20170221; US 201716085061 A 20170221