EP 3422367 A4 20191016 - ELECTROCONDUCTIVE PASTE, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING SAID SUBSTRATE
Title (en)
ELECTROCONDUCTIVE PASTE, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING SAID SUBSTRATE
Title (de)
ELEKTRISCH LEITENDE PASTE, ELEKTRONISCHES SUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DES BESAGTEN SUBSTRATS
Title (fr)
PÂTE ÉLECTROCONDUCTRICE, SUBSTRAT ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DUDIT SUBSTRAT
Publication
Application
Priority
JP 2016088929 W 20161227
Abstract (en)
[origin: EP3422367A1] The present invention pertains to an electroconductive paste containing: high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700°C or less; active metal particles containing an active metal; and an organic vehicle.
IPC 8 full level
H01B 1/22 (2006.01); H01B 1/00 (2006.01); H01B 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP KR US)
C04B 41/009 (2013.01 - EP); C04B 41/5127 (2013.01 - EP); C04B 41/5144 (2013.01 - EP); C04B 41/88 (2013.01 - EP); H01B 1/026 (2013.01 - EP US); H01B 1/22 (2013.01 - EP KR US); H05K 1/0306 (2013.01 - KR US); H05K 1/09 (2013.01 - EP KR US); H05K 1/115 (2013.01 - US); H05K 3/12 (2013.01 - EP US); H05K 3/1283 (2013.01 - KR US); H05K 3/389 (2013.01 - US); C04B 2111/00844 (2013.01 - EP); H05K 2201/0272 (2013.01 - US); H05K 2203/086 (2013.01 - US)
Citation (search report)
- [X] JP 2967929 B2 19991025
- [AD] JP H05226515 A 19930903 - KAWASAKI STEEL CO
- [A] JP 2016193449 A 20161117 - FUJI ELECTRIC CO LTD, et al
- [A] JP H01137516 A 19890530 - SUMITOMO METAL MINING CO
- [A] JP H05156303 A 19930622 - TOKIN CORP
- [A] JP H07230714 A 19950829 - MURATA MANUFACTURING CO
- See references of WO 2018122971A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3422367 A1 20190102; EP 3422367 A4 20191016; EP 3422367 B1 20210428; CN 108885918 A 20181123; CN 108885918 B 20200501; KR 102090168 B1 20200317; KR 20180115321 A 20181022; US 10575412 B2 20200225; US 2019132961 A1 20190502; WO 2018122971 A1 20180705
DOCDB simple family (application)
EP 16925406 A 20161227; CN 201680084127 A 20161227; JP 2016088929 W 20161227; KR 20187027624 A 20161227; US 201616089229 A 20161227