Global Patent Index - EP 3425074 B1

EP 3425074 B1 20210113 - SUBSTANTIALLY PB-FREE ALUMINUM ALLOY COMPOSITION

Title (en)

SUBSTANTIALLY PB-FREE ALUMINUM ALLOY COMPOSITION

Title (de)

IM WESENTLICHEN BLEIFREIE ALUMINIUMLEGIERUNG

Title (fr)

COMPOSITION D'ALLIAGE D'ALUMINIUM SENSIBLEMENT EXEMPT DE PB

Publication

EP 3425074 B1 20210113 (EN)

Application

EP 17181963 A 20170718

Priority

US 201715640722 A 20170703

Abstract (en)

[origin: EP3425074A1] A substantially Pb-free aluminum alloy consisting essentially of (in weight percent) Si < 0.40; Fe < 0.70; Cu 5.0 - 6.0; Zn < 0.30; Bi 0.20 - 0.80; Sn 0.10 - 0.50 with the remainder being aluminum and incidental impurities. In one embodiment for applications that are sensitive to cracking from stresses generated during machining, the Bi/Sn ratio (in terms of weight percent) is less than 1.32/1 aluminium alloy is produced in a T8 temper. On another embodiment for applications that are not sensitive to cracking from stresses during machining but would benefit from smaller machine chip size and more aggressive material removal rates, the aluminum alloy is produced using a T6 temper. The substantially Pb-free aluminum alloy has mechanical properties that include Ultimate Tensile Strength ‰¥ 45.0 KSI / 311 MPa, Yield Strength ‰¥ 38.0 KSI / 262 MPa, and % Elongation ‰¥ 10%.

IPC 8 full level

C22C 21/12 (2006.01)

CPC (source: CN EP KR US)

B21C 23/002 (2013.01 - KR); C22C 21/12 (2013.01 - EP KR US); C22C 21/14 (2013.01 - CN EP KR US); C22C 21/16 (2013.01 - EP US); C22C 21/18 (2013.01 - CN EP KR US); C22F 1/057 (2013.01 - EP US)

Citation (examination)

CN 101294249 A 20081029 - FOSHAN SANSHUI FENGLU ALUMINIU [CN]

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3425074 A1 20190109; EP 3425074 B1 20210113; CN 109207823 A 20190115; KR 20190004235 A 20190111; SI 3425074 T1 20210831; TW 201907022 A 20190216; TW I776910 B 20220911; US 2019003025 A1 20190103; US 2020270731 A1 20200827

DOCDB simple family (application)

EP 17181963 A 20170718; CN 201810668149 A 20180626; KR 20180076626 A 20180702; SI 201730699 T 20170718; TW 107122650 A 20180629; US 201715640722 A 20170703; US 202015930768 A 20200513