EP 3432602 A4 20190626 - PIEZOELECTRIC MICROPHONE
Title (en)
PIEZOELECTRIC MICROPHONE
Title (de)
PIEZOELEKTRISCHES MIKROFON
Title (fr)
MICROPHONE PIÉZOÉLECTRIQUE
Publication
Application
Priority
- CN 201710364823 A 20170522
- CN 2017099519 W 20170829
Abstract (en)
[origin: EP3432602A1] The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes together form a channel. Compared with the traditional hollowed-out structure, the gap of the present invention can hinder the sound from directly spreading via the hollowed-out holes, thereby greatly reducing the amount of leakage of low-and-intermediate frequency signals of the piezoelectric microphone and improving the performance of the piezoelectric microphone. In addition, the gap can also effectively prevent a chip from being damaged by the invasion of dust, particles and water.
IPC 8 full level
H04R 17/02 (2006.01)
CPC (source: CN EP US)
H04R 17/02 (2013.01 - CN EP US); H04R 19/04 (2013.01 - US); H04R 2201/003 (2013.01 - EP US); H10N 30/50 (2023.02 - US)
Citation (search report)
- [I] US 2016037263 A1 20160204 - PAL SAGNIK [US], et al
- [I] US 2011179876 A1 20110728 - KASAI TAKASHI [JP], et al
- [A] US 2017069820 A1 20170309 - HADA TAKUO [JP], et al
- See references of WO 2018214321A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3432602 A1 20190123; EP 3432602 A4 20190626; CN 107071672 A 20170818; CN 107071672 B 20200821; JP 2019520718 A 20190718; JP 6750147 B2 20200902; US 10382870 B2 20190813; US 2019052974 A1 20190214; WO 2018214321 A1 20181129
DOCDB simple family (application)
EP 17844630 A 20170829; CN 2017099519 W 20170829; CN 201710364823 A 20170522; JP 2018532395 A 20170829; US 201715739935 A 20170829