EP 3433045 A1 20190130 - DIAGNOSTIC SOLDER FRAME AND METHOD FOR DETECTING CONTAMINANTS IN A SOLDER BATH OF A SOLDERING INSTALLATION
Title (en)
DIAGNOSTIC SOLDER FRAME AND METHOD FOR DETECTING CONTAMINANTS IN A SOLDER BATH OF A SOLDERING INSTALLATION
Title (de)
DIAGNOSE-LÖTRAHMEN UND VERFAHREN ZUR ERKENNUNG VON VERUNREINIGUNGEN IN EINEM LOTBAD EINER LÖTANLAGE
Title (fr)
CADRE DE BRASAGE DE DIAGNOSTIC ET PROCÉDÉ DE DÉTECTION D'IMPURETÉS DANS UN BAIN DE BRASAGE D'UNE INSTALLATION DE BRASAGE
Publication
Application
Priority
- DE 102016105182 A 20160321
- EP 2017055976 W 20170314
Abstract (en)
[origin: WO2017162481A1] The present invention relates to a diagnostic solder frame (1) for detecting contaminants in a solder bath (3) of a soldering installation, said diagnostic solder frame (1) being configured such that, by means of a transport system (6) of the soldering installation, said diagnostic solder frame (1) can be moved through the soldering installation, and said diagnostic solder frame (1) comprising at least one container (8) with at least a first (9) and a second (11) opening, a first temperature sensor (10), and an evaluation unit (14). The container (8) is arranged such that, during the movement through the soldering installation, a predefinable quantity of solder (3b) passes out of the solder bath (3) through the first opening (9) into the container (8). The temperature sensor (10) projects through the second opening (11) of the container (8) into the container (8) and is arranged so as to be in thermal contact with the predefinable quantity of solder (3b), and serves at least to temporally sense the temperature in the form of a temperature curve (T, (t)). The evaluation unit (14) then draws a conclusion about the contaminants in the solder bath (3, 3b) at least from the temperature curve (T, (t)). Furthermore, the present invention relates to a soldering installation having a diagnostic solder frame (1) according to the invention, to a method for detecting contaminants in a solder bath (3) of a soldering installation, and to a method for operating a soldering installation.
IPC 8 full level
B23K 1/08 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); B23K 31/12 (2006.01); G01N 25/04 (2006.01); B23K 101/42 (2006.01)
CPC (source: EP)
B23K 1/0016 (2013.01); B23K 1/085 (2013.01); B23K 3/0653 (2013.01); B23K 3/087 (2013.01); B23K 31/125 (2013.01); G01N 25/04 (2013.01); B23K 2101/42 (2018.07)
Citation (search report)
See references of WO 2017162481A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102016105182 A1 20170921; CN 108778593 A 20181109; CN 108778593 B 20210528; EP 3433045 A1 20190130; WO 2017162481 A1 20170928
DOCDB simple family (application)
DE 102016105182 A 20160321; CN 201780017489 A 20170314; EP 17710885 A 20170314; EP 2017055976 W 20170314