EP 3440714 A1 20190213 - THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER
Title (en)
THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER
Title (de)
LASER-BESTRAHLUNG DURCH DIE VERMITTLUNGS-RÜCKWAND FÜR CHIP-TRANSFER
Title (fr)
IRRADIATION LASER AU TRAVERS DU PANNEAU ARRIÈRE POUR TRANSFERT DES PUCES
Publication
Application
Priority
- US 201662317773 P 20160404
- IB 2017000334 W 20170320
Abstract (en)
[origin: US2017288102A1] Light emitting devices can be disposed on the front side of a transparent backplane. A laser beam can be irradiated through the transparent backplane and onto a component located on the front side of the transparent backplane. In one embodiment, the component may be a solder material portion that is reflowed to bond the light emitting devices to the transparent backplane. In another embodiment, the component may be a solder material bonded to a defective bonded light emitting device. In this case, the laser irradiation can reflow the solder material to dissociate the defective bonded light emitting device from the transparent backplane. In yet another embodiment, the component may be a device component that is electrically modified by the laser irradiation.
IPC 8 full level
H01L 33/00 (2010.01); H01L 25/075 (2006.01)
CPC (source: EP US)
H01L 25/0753 (2013.01 - EP US); H01L 27/156 (2013.01 - US); H01L 33/0093 (2020.05 - EP US); H01L 33/06 (2013.01 - US); H01L 33/30 (2013.01 - US); H01L 33/62 (2013.01 - US); H01L 2224/83 (2013.01 - EP); H01L 2224/95 (2013.01 - EP); H01L 2933/0066 (2013.01 - EP US)
Citation (search report)
See references of WO 2017175051A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
US 10193038 B2 20190129; US 2017288102 A1 20171005; EP 3440714 A1 20190213; JP 2019511838 A 20190425; US 10693051 B2 20200623; US 2019157533 A1 20190523; WO 2017175051 A1 20171012
DOCDB simple family (application)
US 201715463042 A 20170320; EP 17721829 A 20170320; IB 2017000334 W 20170320; JP 2018548033 A 20170320; US 201916252044 A 20190118