EP 3460623 A1 20190327 - LIQUID IMMERSION COOLED ELECTRONIC DEVICE
Title (en)
LIQUID IMMERSION COOLED ELECTRONIC DEVICE
Title (de)
DURCH FLÜSSIGKEITSIMMERSION GEKÜHLTE ELEKTRONISCHE VORRICHTUNG
Title (fr)
DISPOSITIF ÉLECTRONIQUE REFROIDI PAR IMMERSION DANS UN LIQUIDE
Publication
Application
Priority
JP 2016064527 W 20160516
Abstract (en)
Provided is an electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups. Each of the substrate groups includes a first circuit board having at least one processor and a plurality of main memories mounted onto one surface of the board, a plurality of coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance H1 between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories. The pair of substrate groups are combined while having the first circuit boards arranged at a rear surface side in a direction for reducing a distance H2 between the one surface of the first circuit board of one of the substrate groups and a housing upper surface of each of the coprocessors of the other of the substrate groups.
IPC 8 full level
G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP US)
G06F 1/18 (2013.01 - EP US); G06F 1/20 (2013.01 - EP US); H05K 1/144 (2013.01 - EP); H05K 7/02 (2013.01 - EP); H05K 7/20 (2013.01 - EP); H05K 7/20236 (2013.01 - EP US); H05K 7/20263 (2013.01 - US); H05K 7/20772 (2013.01 - EP); G06F 2200/201 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3460623 A1 20190327; EP 3460623 A4 20200101; CN 109154845 A 20190104; JP 6244068 B1 20171206; JP WO2017199314 A1 20180531; US 10606326 B2 20200331; US 2019294221 A1 20190926; WO 2017199314 A1 20171123
DOCDB simple family (application)
EP 16902334 A 20160516; CN 201680085728 A 20160516; JP 2016064527 W 20160516; JP 2017541890 A 20160516; US 201616302596 A 20160516