Global Patent Index - EP 3460627 A4

EP 3460627 A4 20200122 - LIQUID IMMERSION COOLED ELECTRONIC DEVICE

Title (en)

LIQUID IMMERSION COOLED ELECTRONIC DEVICE

Title (de)

DURCH FLÜSSIGKEITSIMMERSION GEKÜHLTE ELEKTRONISCHE VORRICHTUNG

Title (fr)

DISPOSITIF ÉLECTRONIQUE REFROIDI PAR IMMERSION DANS UN LIQUIDE

Publication

EP 3460627 A4 20200122 (EN)

Application

EP 16902338 A 20160516

Priority

JP 2016064535 W 20160516

Abstract (en)

[origin: EP3460627A1] Provided is an electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, a plurality of storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and a plurality of flash storage units mounted on the respective storage substrates. The backplane includes a combination of a plurality of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.

IPC 8 full level

G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

G06F 1/18 (2013.01 - EP US); G06F 1/182 (2013.01 - US); G06F 1/183 (2013.01 - US); G06F 1/20 (2013.01 - EP US); H05K 7/20236 (2013.01 - EP US); H05K 7/20772 (2013.01 - EP US); G06F 2200/201 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3460627 A1 20190327; EP 3460627 A4 20200122; EP 3460627 B1 20211208; CN 109154846 A 20190104; JP 6244067 B1 20171206; JP WO2017199318 A1 20180531; US 11009925 B2 20210518; US 2019179382 A1 20190613; WO 2017199318 A1 20171123

DOCDB simple family (application)

EP 16902338 A 20160516; CN 201680085731 A 20160516; JP 2016064535 W 20160516; JP 2017541889 A 20160516; US 201616302580 A 20160516