Global Patent Index - EP 3463733 A1

EP 3463733 A1 20190410 - PRODUCTION LINE FOR SOLDERING

Title (en)

PRODUCTION LINE FOR SOLDERING

Title (de)

FERTIGUNGSLINIE ZUM LÖTEN

Title (fr)

LIGNE DE FABRICATION POUR LE BRASAGE

Publication

EP 3463733 A1 20190410 (DE)

Application

EP 17724543 A 20170517

Priority

  • DE 102016110040 A 20160531
  • EP 2017061806 W 20170517

Abstract (en)

[origin: WO2017207272A1] The invention relates to a production line for soldering components (1) onto a printed circuit board (2), comprising: a soldering furnace (3) with at least two temperature zones (Z1, Z2,..), in which there is a predetermined temperature profile (Tp), a transporting device (4), which is designed to transport the printed circuit boards (2) through the temperature zones (Z1, Z2,..) of the soldering furnace (3) in a transporting direction (Rt), and also a control device (5); wherein, in at least one temperature zone (Z1; Z2,..), at least two heating elements (60, 61,..) are designed and arranged in such a way that a surface (10) to be soldered of the printed circuit boards (2) transported through the soldering furnace (3) is heated by the heating elements (60, 61,..), wherein the heating elements (60, 61,..) are arranged offset one behind the other in the transporting direction (Rt) and are facing the surface (10) to be soldered, wherein, in at least one of the temperature zones (Z1; Z2,..), at least two fans (70, 71,..) are provided, arranged offset one behind the other in the transporting direction (Rt) and facing the surface (10) to be soldered, and wherein the control device (5) is designed for activating the heating elements (60, 61,..) and the fans (70, 71,..) in such a way that the predetermined temperature profile (Tp) is obtained on the surface (10) to be soldered of the printed circuit board (3) in the temperature zones (Z1; Z2,..).

IPC 8 full level

B23K 3/047 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); H05K 3/34 (2006.01)

CPC (source: EP US)

B23K 1/0016 (2013.01 - EP US); B23K 1/008 (2013.01 - EP US); B23K 3/0478 (2013.01 - EP US); B23K 3/08 (2013.01 - US); H05K 3/0085 (2013.01 - US); H05K 3/3494 (2013.01 - EP US); B23K 2101/36 (2018.07 - US); H05K 2203/081 (2013.01 - US)

Citation (search report)

See references of WO 2017207272A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102016110040 A1 20171130; CN 109153092 A 20190104; EP 3463733 A1 20190410; US 2019381591 A1 20191219; WO 2017207272 A1 20171207

DOCDB simple family (application)

DE 102016110040 A 20160531; CN 201780028073 A 20170517; EP 17724543 A 20170517; EP 2017061806 W 20170517; US 201716305431 A 20170517