EP 3467044 A1 20190410 - THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Title (en)
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Title (de)
WÄRMELEITFÄHIGE SILIKONZUSAMMENSETZUNG UND GEHÄRTETES PRODUKT DARAUS
Title (fr)
COMPOSITION DE SILICONE THERMIQUEMENT CONDUCTRICE ET SON PRODUIT DURCI
Publication
Application
Priority
- JP 2016103216 A 20160524
- JP 2017016458 W 20170426
Abstract (en)
A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 µm and crushed alumina having an average particle size of 0.1-5 µm as a thermally conductive filler, contains 15-55 mass% of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass% of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
IPC 8 full level
C08L 83/07 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08L 83/05 (2006.01); C08L 83/06 (2006.01); C09K 5/10 (2006.01)
CPC (source: EP KR US)
C08G 77/12 (2013.01 - KR); C08K 3/22 (2013.01 - EP KR US); C08K 3/28 (2013.01 - EP KR US); C08K 5/14 (2013.01 - KR); C08L 83/06 (2013.01 - KR US); C08L 83/14 (2013.01 - US); C09K 5/10 (2013.01 - US); C08G 77/08 (2013.01 - KR); C08G 77/70 (2013.01 - US); C08K 2003/2227 (2013.01 - EP KR US); C08K 2003/282 (2013.01 - EP KR US); C08K 2201/001 (2013.01 - EP KR US); C08K 2201/005 (2013.01 - EP KR US); C08L 2201/08 (2013.01 - US); C08L 2205/025 (2013.01 - US); C09K 5/08 (2013.01 - KR)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3467044 A1 20190410; EP 3467044 A4 20200115; EP 3467044 B1 20240424; CN 109312159 A 20190205; CN 109312159 B 20210702; JP 2017210518 A 20171130; JP 6610429 B2 20191127; KR 102257273 B1 20210527; KR 20190011743 A 20190207; TW 201816068 A 20180501; TW I720197 B 20210301; US 10647830 B2 20200512; US 2019292349 A1 20190926; WO 2017203924 A1 20171130
DOCDB simple family (application)
EP 17802522 A 20170426; CN 201780031608 A 20170426; JP 2016103216 A 20160524; JP 2017016458 W 20170426; KR 20187035427 A 20170426; TW 106115495 A 20170510; US 201716303056 A 20170426