EP 3471434 A1 20190417 - HEARING AID HAVING A MICROPHONE MODULE WITH IMPROVED ULTRASOUND PROPERTIES
Title (en)
HEARING AID HAVING A MICROPHONE MODULE WITH IMPROVED ULTRASOUND PROPERTIES
Title (de)
HÖRGERÄT MIT EINEM MIKROFONMODUL MIT VERBESSERTEN ULTRASCHALLEIGENSCHAFTEN
Title (fr)
APPAREIL AUDITIF POSSÉDANT UN MODULE DE MICROPHONE PRÉSENTANT DE MEILLEURES PROPRIÉTÉS D'ULTRASONS
Publication
Application
Priority
EP 18158599 A 20180226
Abstract (en)
A microphone module for use in a hearing aid comprises a PCB, a MEMS microphone mounted on one surface of the PCB, having an acoustic inlet facing the one surface of the PCB, an opening formed in the PCB, which faces the acoustic inlet of the MEMS microphone, a snout element, which is provided opposing the MEMS microphone on the other surface of the PCB, and a passage extending through the snout element, one end thereof facing the opening in the PCB. The passage forms an acoustic channel and is configured to be longer than the length of the opening in the printed circuit board, and at least a part of the passage has a cross-sectional area which is smaller than the opening area in the PCB.
IPC 8 full level
H04R 1/28 (2006.01); H04R 25/00 (2006.01)
CPC (source: EP)
H04R 1/2846 (2013.01); H04R 25/48 (2013.01); H04R 25/604 (2013.01); H04R 2201/003 (2013.01)
Citation (search report)
- [XYI] US 2015237431 A1 20150820 - JEZIOREK PETER N [US], et al
- [XYI] WO 2014035571 A1 20140306 - APPLE INC [US]
- [Y] US 2012177237 A1 20120712 - SHUKLA ASHUTOSH Y [US], et al
- [A] US 2016234587 A1 20160811 - KAPPUS BRIAN ALAN [US], et al
- [A] US 2013051580 A1 20130228 - MILLER THOMAS E [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 18158599 A 20180226