EP 3474639 B1 20210714 - EMBEDDING A COMPONENT INTO A COMPONENT CARRIER BY TRANSFERRING THE COMPONENT INTO A CAVITY BEING ALREADY FILLED WITH FILLING MATERIAL
Title (en)
EMBEDDING A COMPONENT INTO A COMPONENT CARRIER BY TRANSFERRING THE COMPONENT INTO A CAVITY BEING ALREADY FILLED WITH FILLING MATERIAL
Title (de)
EINBETTUNG EINER KOMPONENTE IN EINEN KOMPONENTENTRÄGER DURCH ÜBERTRAGUNG DER KOMPONENTE IN EINEN BEREITS MIT FÜLLMATERIAL GEFÜLLTEN HOHLRAUM
Title (fr)
INCORPORATION D'UN COMPOSANT DANS UN SUPPORT DE COMPOSANT EN TRANSFÉRANT LE COMPOSANT DANS UNE CAVITÉ DÉJÀ REMPLIE DE MATÉRIAU DE REMPLISSAGE
Publication
Application
Priority
EP 17197559 A 20171020
Abstract (en)
[origin: EP3474639A1] Described is a method for manufacturing a component carrier (160) having an embedded component (120). The method comprises providing a support structure (100); attaching an electronic component (120) at a surface of the support structure (100); providing a core structure (130); forming a cavity (130a) within the core structure (130); partially filling the cavity (130a) with a predefined amount of filling material (140); positioning the support structure (100) relative to the core structure (130) in such a manner that the electronic component (120) is transferred into the cavity (130a) and is dipped into the filling material (140); curing the filling material (140) such that the component (120) within the cavity (130a) is fixed to core structure (130); and removing the support structure (100).
IPC 8 full level
H05K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H01L 21/4857 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/83 (2013.01); H05K 1/185 (2013.01); H05K 1/188 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0269 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09918 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/167 (2013.01)
Citation (examination)
US 2009091022 A1 20090409 - MEYER THORSTEN [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 17197559 A 20171020