EP 3474647 A1 20190424 - COOLING SYSTEM OF WORKING MEDIUM CONTACT TYPE FOR HIGH-POWER DEVICE, AND WORKING METHOD THEREOF
Title (en)
COOLING SYSTEM OF WORKING MEDIUM CONTACT TYPE FOR HIGH-POWER DEVICE, AND WORKING METHOD THEREOF
Title (de)
KÜHLSYSTEM MIT ARBEITSMITTELKONTAKT FÜR EINE HOCHLEISTUNGSVORRICHTUNG UND BETRIEBSVERFAHREN DAFÜR
Title (fr)
SYSTÈME DE REFROIDISSEMENT DU TYPE À CONTACT DE FLUIDE MOTEUR POUR DISPOSITIF HAUTE PUISSANCE, ET SON PROCÉDÉ DE FONCTIONNEMENT
Publication
Application
Priority
- CN 201610439360 A 20160616
- CN 2016102650 W 20161020
Abstract (en)
Disclosed is a working contact cooling system for a high-power device (1), wherein the sealed case body (8) is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant (9), and an outer wall of the outer layer of the sealed case body (8) is provided with heat dissipating fins (10); the sealed case body (8) is provided with an insulating liquid heat-conductive coolant (2), the coolant pump (6) sinks in the insulating liquid heat-conductive coolant (2), the filter (7) is installed at an inlet of the coolant pump (6), the coolant pump (6) is connected to the spray main pipe (5), and a plurality of spray branch pipes (4) are connected in parallel with the spray main pipe (5), each of the spray branch pipes (4) is provided with a plurality of nozzles (3), and the nozzles (3) face the high-power device (1); the nozzles (3) spray against front and back surfaces of the high-power device (1) to form a relatively open spray structure; the insulating liquid heat-conductive coolant (2) is a non-polar substance, and the insulating liquid heat-conductive coolant (2) has no phase change during the spraying process. The present invention has reasonable heat dissipation structure and effective heat dissipation.
IPC 8 full level
H01L 23/367 (2006.01); H05K 7/20 (2006.01)
CPC (source: CN EP US)
H01L 23/367 (2013.01 - CN); H01L 23/427 (2013.01 - EP US); H01L 23/44 (2013.01 - EP US); H01L 23/473 (2013.01 - CN US); H01L 23/4735 (2013.01 - CN EP US); H05K 7/20 (2013.01 - CN); H05K 7/20218 (2013.01 - CN US); H05K 7/20236 (2013.01 - EP US); H05K 7/2029 (2013.01 - US); H05K 7/20345 (2013.01 - EP US); H05K 7/20927 (2013.01 - EP US); H05K 7/20272 (2013.01 - US); H05K 7/20281 (2013.01 - US); Y02T 10/70 (2013.01 - EP); Y02T 10/7072 (2013.01 - EP); Y02T 90/14 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
US 10424532 B2 20190924; US 2019043785 A1 20190207; CN 105934139 A 20160907; CN 105934139 B 20180522; EP 3474647 A1 20190424; EP 3474647 A4 20190821; EP 3474647 B1 20200415; JP 2019513296 A 20190523; JP 6588654 B2 20191009; WO 2017215168 A1 20171221
DOCDB simple family (application)
US 201616076331 A 20161020; CN 2016102650 W 20161020; CN 201610439360 A 20160616; EP 16905280 A 20161020; JP 2018544345 A 20161020