EP 3480843 A1 20190508 - METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR CARRYING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT-MOUNTED SUBSTRATE
Title (en)
METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR CARRYING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT-MOUNTED SUBSTRATE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES GEHÄUSESUBSTRATS FÜR EIN HALBLEITERELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS MIT MONTIERTEM HALBLEITERELEMENT
Title (fr)
PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE BOÎTIER PERMETTANT DE PORTER UN ÉLÉMENT SEMI-CONDUCTEUR, ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT MONTÉ SUR UN ÉLÉMENT SEMI-CONDUCTEUR
Publication
Application
Priority
- JP 2016131702 A 20160701
- JP 2017005949 A 20170117
- JP 2017023237 W 20170623
Abstract (en)
A method for manufacturing a package substrate for mounting a semiconductor device, comprising a substrate forming step (a) of forming a supporting substrate for circuit formation comprising a first insulating resin layer, a release layer comprising at least a silicon compound, and ultrathin copper foil having a thickness of 1 µm to 5 µm, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole by copper electroplating and/or electroless copper plating to form a second wiring conductor; a peeling step (e) of peeling the first insulating resin layer from the supporting substrate for circuit formation on which the first wiring conductor and the second wiring conductor are formed; and a removal step (f) of removing the release layer and/or the ultrathin copper foil.
IPC 8 full level
H01L 23/12 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP KR US)
B32B 15/08 (2013.01 - US); B32B 15/20 (2013.01 - US); C25D 7/00 (2013.01 - EP KR US); H01L 21/4857 (2013.01 - EP US); H01L 23/142 (2013.01 - KR); H01L 23/315 (2013.01 - KR); H01L 23/49822 (2013.01 - EP US); H01L 23/525 (2013.01 - KR); H05K 3/06 (2013.01 - KR); H05K 3/18 (2013.01 - KR); H05K 3/46 (2013.01 - EP US); H05K 3/4644 (2013.01 - KR); B32B 2457/08 (2013.01 - US); C23C 18/38 (2013.01 - US); C23F 17/00 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3480843 A1 20190508; EP 3480843 A4 20190619; EP 3480843 B1 20210505; CN 109417055 A 20190301; CN 117241501 A 20231215; JP 7044997 B2 20220331; JP WO2018003703 A1 20190516; KR 102394519 B1 20220504; KR 20190024879 A 20190308; TW 201806110 A 20180216; TW I718316 B 20210211; US 10727081 B2 20200728; US 2019148169 A1 20190516; WO 2018003703 A1 20180104
DOCDB simple family (application)
EP 17820060 A 20170623; CN 201780040347 A 20170623; CN 202311281435 A 20170623; JP 2017023237 W 20170623; JP 2018525137 A 20170623; KR 20187033288 A 20170623; TW 106121688 A 20170629; US 201716314568 A 20170623