EP 3504946 A4 20200527 - CASINGS OF ELECTRONIC DEVICES
Title (en)
CASINGS OF ELECTRONIC DEVICES
Title (de)
GEHÄUSE VON ELEKTRONISCHEN VORRICHTUNGEN
Title (fr)
BOÎTIERS DE DISPOSITIFS ÉLECTRONIQUES
Publication
Application
Priority
US 2017014483 W 20170123
Abstract (en)
[origin: WO2018136090A1] In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.
IPC 8 full level
H05K 5/04 (2006.01); B29C 45/14 (2006.01); B32B 3/24 (2006.01); B32B 7/04 (2019.01); B32B 15/08 (2006.01); G06F 1/16 (2006.01); H01Q 1/24 (2006.01); H04M 1/02 (2006.01)
CPC (source: EP US)
B29C 45/14344 (2013.01 - EP); B32B 7/04 (2013.01 - US); G05B 19/40937 (2013.01 - US); G06F 1/1613 (2013.01 - EP US); G06F 1/1656 (2013.01 - EP US); G06F 1/1698 (2013.01 - EP); H01Q 1/243 (2013.01 - EP); H04M 1/0202 (2013.01 - EP); H05K 5/0004 (2013.01 - US); H05K 5/0217 (2013.01 - US); H05K 5/04 (2013.01 - US)
Citation (search report)
- [XI] US 2009265915 A1 20091029 - LEE HAN-MING [TW], et al
- [XI] US 2016207236 A1 20160721 - TSUBOTA TAISUKE [JP], et al
- [X] CN 106102389 A 20161109 - GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
- [X] CN 103376835 A 20131030 - MICRO ELECTRONICS HOLDING CO LTD
- See references of WO 2018136090A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2018136090 A1 20180726; CN 109845419 A 20190604; EP 3504946 A1 20190703; EP 3504946 A4 20200527; EP 3504946 B1 20220810; US 10588225 B2 20200310; US 2019053390 A1 20190214
DOCDB simple family (application)
US 2017014483 W 20170123; CN 201780060913 A 20170123; EP 17892660 A 20170123; US 201716076502 A 20170123