EP 3511703 A3 20190828 - GAS SENSOR PACKAGE AND SENSING APPARATUS INCLUDING THE SAME
Title (en)
GAS SENSOR PACKAGE AND SENSING APPARATUS INCLUDING THE SAME
Title (de)
GASSENSORGEHÄUSE UND SENSORVORRICHTUNG MIT DIESEM GEHÄUSE
Title (fr)
ENSEMBLE CAPTEUR DE GAZ ET APPAREIL DE DÉTECTION LE COMPRENANT
Publication
Application
Priority
KR 20180003171 A 20180110
Abstract (en)
A gas sensor package (10, 11, 12, 13, 14, 15) includes a package substrate (100) having a hole (190, 390), the hole (190, 390) having an end that is opened at a first surface (100A, 100B, 20A, 20B) of the package substrate (100); a gas sensor disposed in the hole (190, 390) of the package substrate (100); a fixing plate (300) disposed on the first surface (100A, 100B, 20A, 20B) of the package substrate (100), the fixing plate (300) having a vent hole (390) extending between a top surface (220A, 300A, 600A) and a bottom surface (190B, 300B) of the fixing plate (300), the bottom surface (190B, 300B) of the fixing plate (300) facing toward the package substrate (100) and the top surface (220A, 300A, 600A) of the fixing plate (300) facing away from the package substrate (100), and the fixing plate (300) overlapping the hole (190, 390) of the package substrate (100) when viewed in a plan view; and a protective film (400) attached to the fixing plate (300). The protective film (400) overlaps the vent hole (390) when viewed in a plan view. (Fig. 1A)
IPC 8 full level
G01N 27/12 (2006.01); G01D 11/24 (2006.01); H01L 23/02 (2006.01); H01L 27/02 (2006.01)
CPC (source: CN EP KR US)
G01N 27/048 (2013.01 - US); G01N 27/12 (2013.01 - CN); G01N 27/122 (2013.01 - CN); G01N 27/123 (2013.01 - US); G01N 27/125 (2013.01 - KR); G01N 27/128 (2013.01 - EP US); G01N 27/129 (2013.01 - KR); G01N 27/407 (2013.01 - US); G01N 33/0027 (2013.01 - EP US); H01L 23/02 (2013.01 - US); H01L 23/3107 (2013.01 - US); H01L 23/49805 (2013.01 - US); H01L 24/48 (2013.01 - US); H01L 27/0248 (2013.01 - US); H05K 1/0306 (2013.01 - US); H01L 2224/48145 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H05K 2201/10151 (2013.01 - US)
C-Set (source: EP US)
Citation (search report)
- [Y] KR 20060044222 A 20060516 - LG ELECTRONICS INC [KR]
- [Y] JP 2017122616 A 20170713 - NGK SPARK PLUG CO
- [XI] KR 20170085395 A 20170724 - LG INNOTEK CO LTD [KR], et al
- [XI] US 2010133629 A1 20100603 - ZHANG WENWEI [GB], et al
- [A] US 2015323510 A1 20151112 - HUYNH STEVEN [US], et al
- [A] CN 106298704 A 20170104 - INST GEOLOGY & GEOPHYSICS CAS
- [A] US 2015226688 A1 20150813 - WATANABE MASAYA [JP], et al
- [A] JP S646833 A 19890111 - TOSHIBA CORP
- [A] US 2015287659 A1 20151008 - LIU CHIEN-HUNG [TW]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3511703 A2 20190717; EP 3511703 A3 20190828; EP 3511703 B1 20240703; CN 110018202 A 20190716; CN 110018202 B 20240927; JP 2019120698 A 20190722; JP 7210271 B2 20230123; KR 102520038 B1 20230412; KR 20190085263 A 20190718; SG 10201900168R A 20190827; US 11067554 B2 20210720; US 2019212312 A1 20190711
DOCDB simple family (application)
EP 18209061 A 20181129; CN 201811570923 A 20181221; JP 2018244486 A 20181227; KR 20180003171 A 20180110; SG 10201900168R A 20190108; US 201816124385 A 20180907