EP 3513416 A1 20190724 - METHOD FOR PRODUCING ELECTRONIC COMPONENTS BY MEANS OF 3D PRINTING
Title (en)
METHOD FOR PRODUCING ELECTRONIC COMPONENTS BY MEANS OF 3D PRINTING
Title (de)
VERFAHREN ZUR HERSTELLUNG VON ELEKTRONISCHEN BAUTEILEN MITTELS 3D-DRUCK
Title (fr)
PROCÉDÉ DE FABRICATION DE COMPOSANTS ÉLECTRONIQUES PAR IMPRESSION 3D
Publication
Application
Priority
- DE 102016011098 A 20160915
- EP 2017072113 W 20170904
Abstract (en)
[origin: CA3031862A1] The present invention relates to a method for producing electronic components, in particular anodes, from valve metal powder by means of 3D printing and to the use of a valve metal powder for the production of electronic components by means of 3D printing. The present invention further relates to an anode which can be obtained by the method according to the invention as well as to a capacitor which comprises the anode according to the invention.
IPC 8 full level
B33Y 80/00 (2015.01); H01G 9/052 (2006.01)
CPC (source: EP IL KR US)
B22F 5/00 (2013.01 - IL); B22F 10/20 (2021.01 - IL); B22F 10/28 (2021.01 - EP US); B29C 64/153 (2017.07 - IL US); B33Y 10/00 (2014.12 - EP IL US); B33Y 80/00 (2014.12 - EP IL KR US); C22C 1/045 (2013.01 - IL); C22C 27/02 (2013.01 - EP IL US); H01G 9/0029 (2013.01 - KR); H01G 9/052 (2013.01 - EP IL KR US); B22F 5/00 (2013.01 - EP US); B22F 10/36 (2021.01 - EP US); B22F 10/73 (2021.01 - EP US); B22F 12/60 (2021.01 - EP US); B22F 2999/00 (2013.01 - EP IL US); C22C 1/045 (2013.01 - EP US); Y02P 10/25 (2015.11 - EP IL)
Citation (search report)
See references of WO 2018050473A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102016011098 A1 20180315; CA 3031862 A1 20180322; CN 109690711 A 20190426; CN 109690711 B 20220412; EP 3513416 A1 20190724; IL 264632 A 20190331; IL 264632 B 20221101; IL 264632 B2 20230301; JP 2019529709 A 20191017; JP 7094271 B2 20220701; KR 20190049726 A 20190509; KR 20230010840 A 20230119; MX 2019001774 A 20190704; PH 12019500536 A1 20191028; TW 201822916 A 20180701; TW I734832 B 20210801; US 10872732 B2 20201222; US 2019206629 A1 20190704; WO 2018050473 A1 20180322
DOCDB simple family (application)
DE 102016011098 A 20160915; CA 3031862 A 20170904; CN 201780056290 A 20170904; EP 17764368 A 20170904; EP 2017072113 W 20170904; IL 26463219 A 20190204; JP 2019514292 A 20170904; KR 20197007073 A 20170904; KR 20237000804 A 20170904; MX 2019001774 A 20170904; PH 12019500536 A 20190312; TW 106131341 A 20170913; US 201716331529 A 20170904