EP 3520649 A4 20200115 - THIN FILM AFFIXING DEVICE AND THIN FILM FORMATION METHOD
Title (en)
THIN FILM AFFIXING DEVICE AND THIN FILM FORMATION METHOD
Title (de)
DÜNNSCHICHT-FIXIERVORRICHTUNG UND VERFAHREN ZUR BILDUNG EINER DÜNNSCHICHT
Title (fr)
DISPOSITIF DE FIXATION DE FILM MINCE ET PROCÉDÉ DE FORMATION DE FILM MINCE
Publication
Application
Priority
- JP 2016187856 A 20160927
- JP 2017031299 W 20170831
Abstract (en)
[origin: US2019200732A1] A thin film application device used to apply a thin film on an applied face of an application object includes a frame mountable to the application object, and a thin film holding member, that has a tentative application portion to which the thin film can be tentatively applied to a side face facing the applied face in use, and that is supported by the frame so that the tentative application portion can be pressed against the applied face, and that is detachably mountable to the frame.
IPC 8 full level
A45D 44/22 (2006.01); A45D 44/00 (2006.01)
CPC (source: EP US)
A45D 44/002 (2013.01 - EP US); A45D 44/22 (2013.01 - EP US); A45D 2200/1036 (2013.01 - EP US); A45D 2200/25 (2013.01 - EP US)
Citation (search report)
- [A] JP 3175155 U 20120426
- [A] TW M297835 U 20060921 - USUN TECHNOLOGY CO LTD [TW]
- [A] TW 201544402 A 20151201 - LITAR INTERNAT DEVELOPMEMT CO LTD [TW]
- [A] WO 2014003450 A1 20140103 - CHAI CHAN [KR]
- See references of WO 2018061596A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2019200732 A1 20190704; CN 109788838 A 20190521; EP 3520649 A1 20190807; EP 3520649 A4 20200115; EP 3520649 B1 20210120; JP WO2018061596 A1 20190718; WO 2018061596 A1 20180405
DOCDB simple family (application)
US 201916299215 A 20190312; CN 201780058260 A 20170831; EP 17855554 A 20170831; JP 2017031299 W 20170831; JP 2018542022 A 20170831