EP 3527053 A1 20190821 - HEAT-DISSIPATING ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
HEAT-DISSIPATING ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
WÄRME ABLEITENDE ANORDNUNG UND VERFAHREN ZUR HERSTELLUNG
Title (fr)
ENSEMBLE DISSIPATEUR DE CHALEUR ET PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102016220265 A 20161017
- EP 2017073646 W 20170919
Abstract (en)
[origin: WO2018072951A1] Disclosed is a heat-dissipating arrangement having, wherein the heat-dissipating arrangement has at least one power module which has a printed circuit board (2) having components (3) to be cooled arranged thereon, and at least one heat sink (1) arranged on the printed circuit board (2) and over the components (3) to be cooled. On at least one of the components (3) to be cooled there is at least one heat-conducting element (100) which has a predefined structure extending from the printed circuit board (2) away from the printed circuit board into the heat sink (1), the heat-conducting element (100) containing a heat-dissipating medium in the interior thereof.
IPC 8 full level
H05K 7/20 (2006.01); F28D 15/02 (2006.01)
CPC (source: EP US)
B33Y 80/00 (2014.12 - EP); F28D 15/0233 (2013.01 - EP US); H01L 23/427 (2013.01 - EP); H05K 7/20336 (2013.01 - EP US); H05K 7/20936 (2013.01 - EP US); F28F 2255/18 (2013.01 - EP)
Citation (search report)
See references of WO 2018072951A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102016220265 A1 20180419; CN 109845424 A 20190604; CN 109845424 B 20211109; EP 3527053 A1 20190821; JP 2019533903 A 20191121; US 2019378780 A1 20191212; WO 2018072951 A1 20180426
DOCDB simple family (application)
DE 102016220265 A 20161017; CN 201780062948 A 20170919; EP 17772367 A 20170919; EP 2017073646 W 20170919; JP 2019520597 A 20170919; US 201716341571 A 20170919