EP 3528600 B1 20220309 - ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR
Title (en)
ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR
Title (de)
ELEKTRONISCHE VORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION
Publication
Application
Priority
- JP 2016202796 A 20161014
- JP 2017033681 W 20170919
Abstract (en)
[origin: EP3528600A1] An electronic device (100) includes electronic components (110, 120), a molded resin element (130) wherein the electronic components (110, 120) are embedded and secured, and a heat transfer layer (150); the heat transfer layer (150) has a higher thermal conductivity than the molded resin element (130). The heat transfer layer (150) is in contact with portions of the electronic components (110, 120) other than an electrode pad (111) and a terminal (122). This prevents increases in the cost of manufacturing the electronic device (100) and the allows the electronic device (100) to be thinner.
IPC 8 full level
H05K 1/02 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP US)
H01B 5/14 (2013.01 - EP US); H01B 13/00 (2013.01 - EP US); H01L 21/4867 (2013.01 - US); H01L 21/565 (2013.01 - US); H01L 23/3135 (2013.01 - US); H01L 23/49838 (2013.01 - US); H05K 1/02 (2013.01 - US); H05K 1/0207 (2013.01 - EP); H05K 1/185 (2013.01 - EP); H05K 3/00 (2013.01 - US); H05K 7/20 (2013.01 - EP US); H01L 23/293 (2013.01 - US); H01L 23/49866 (2013.01 - US); H01L 2224/16225 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H05K 3/125 (2013.01 - EP); H05K 3/4664 (2013.01 - EP); H05K 2203/013 (2013.01 - EP); H05K 2203/016 (2013.01 - EP); H05K 2203/1316 (2013.01 - EP); H05K 2203/1469 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3528600 A1 20190821; EP 3528600 A4 20200108; EP 3528600 B1 20220309; CN 109691242 A 20190426; CN 109691242 B 20210817; JP 2018064060 A 20180419; JP 6610497 B2 20191127; TW 201814853 A 20180416; TW I659510 B 20190511; US 10879145 B2 20201229; US 2019259679 A1 20190822; WO 2018070192 A1 20180419
DOCDB simple family (application)
EP 17859588 A 20170919; CN 201780055091 A 20170919; JP 2016202796 A 20161014; JP 2017033681 W 20170919; TW 106132788 A 20170925; US 201716334036 A 20170919