EP 3529828 A1 20190828 - METHOD FOR THE PRODUCTION OF A MICROELECTRONIC CHIP TO BE HYBRIDISED TO A SECOND CHIP
Title (en)
METHOD FOR THE PRODUCTION OF A MICROELECTRONIC CHIP TO BE HYBRIDISED TO A SECOND CHIP
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES MIKROELEKTRONISCHEN CHIPS ZUR HYBRIDISIERUNG MIT EINEM ZWEITEN CHIP
Title (fr)
PROCEDE DE REALISATION D'UNE PUCE MICROELECTRONIQUE DESTINEE A ETRE HYBRIDEE A UNE DEUXIEME PUCE
Publication
Application
Priority
- FR 1660118 A 20161019
- FR 2017052828 W 20171016
Abstract (en)
[origin: WO2018073517A1] The invention relates to a method for the production of a first microelectronic chip (P1) comprising a layer of interest (13) having a connection surface (11) to be hybridised to a second microelectronic chip (P2), said method comprising the following steps: - deposition of a layer of adhesive (14) on a surface (13a) of the layer of interest (13), opposite the first connection surface (11); attachment of a so-called grip layer (15) to the layer of adhesive (14); and, prior to the steps in which the adhesive is deposited and the grip layer (15) is attached, determination of a maximum thickness (F1) and minimum (F2) and maximum (F3) Young's modulus values for the layer of adhesive (14), and the minimum thickness (F4) for the grip layer (15).
IPC 8 full level
H01L 21/60 (2006.01); H01L 21/683 (2006.01); H01L 27/146 (2006.01)
CPC (source: EP US)
H01L 21/6835 (2013.01 - EP); H01L 24/81 (2013.01 - EP); H01L 25/167 (2013.01 - US); H01L 27/1469 (2013.01 - EP); H01L 31/02005 (2013.01 - US); H01L 31/186 (2013.01 - US); H01L 33/0095 (2013.01 - US); H01L 33/62 (2013.01 - US); H01L 2221/68368 (2013.01 - EP); H01L 2221/68372 (2013.01 - EP); H01L 2224/13109 (2013.01 - EP); H01L 2224/13111 (2013.01 - EP); H01L 2224/16145 (2013.01 - EP); H01L 2224/81005 (2013.01 - EP); H01L 2224/8112 (2013.01 - EP); H01L 2224/81191 (2013.01 - EP); H01L 2224/81815 (2013.01 - EP); H01L 2924/351 (2013.01 - EP); H01L 2933/0066 (2013.01 - US)
Citation (search report)
See references of WO 2018073517A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
FR 3057706 A1 20180420; FR 3057706 B1 20181207; EP 3529828 A1 20190828; US 11165005 B2 20211102; US 2020058837 A1 20200220; WO 2018073517 A1 20180426
DOCDB simple family (application)
FR 1660118 A 20161019; EP 17792128 A 20171016; FR 2017052828 W 20171016; US 201716342446 A 20171016