EP 3547377 A1 20191002 - METHOD OF MANUFACTURING LIGHT EMITTING MODULE, AND LIGHT EMITTING MODULE
Title (en)
METHOD OF MANUFACTURING LIGHT EMITTING MODULE, AND LIGHT EMITTING MODULE
Title (de)
VERFAHREN ZUR HERSTELLEN EINES LICHTEMITTIERENDEN MODULS UND LICHTEMITTIERENDES MODUL
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE ÉLECTROLUMINESCENT ET MODULE ÉLECTROLUMINESCENT
Publication
Application
Priority
- JP 2018059064 A 20180326
- JP 2019056065 A 20190325
Abstract (en)
The method of manufacturing a light emitting module (100) includes: providing a light guiding plate (1) having a first main surface (1c) serving as a light emitting surface; and a second main surface (1d) positioned opposite to the first main surface (1c) and provided with a recess (1b); providing a light adjustment portion (10) containing a fluorescent material; providing a light emitting element unit (3) in which a light emitting element (11) comprising an electrode is integrally bonded to the light adjustment portion (10); bonding the light adjustment portion (10) of the light emitting element unit (3) to the recess (1 b); and forming wiring on the electrode (11b) of the light emitting element (11).
IPC 8 full level
H01L 33/50 (2010.01); H01L 33/58 (2010.01); F21V 8/00 (2006.01); G02F 1/1335 (2006.01); H01L 25/075 (2006.01)
CPC (source: EP US)
G02F 1/133603 (2013.01 - US); G02F 1/133606 (2013.01 - US); G02F 1/133611 (2013.01 - US); H01L 25/0753 (2013.01 - US); H01L 33/36 (2013.01 - US); H01L 33/507 (2013.01 - EP US); H01L 33/56 (2013.01 - US); H01L 33/58 (2013.01 - EP US); H01L 33/62 (2013.01 - US); G02B 6/0021 (2013.01 - US); G02B 6/0023 (2013.01 - US); G02F 1/133601 (2021.01 - EP US); G02F 1/133603 (2013.01 - EP); G02F 1/133606 (2013.01 - EP); G02F 1/133607 (2021.01 - EP US); G02F 1/133611 (2013.01 - EP); G02F 1/133612 (2021.01 - US); G02F 1/133614 (2021.01 - EP US); H01L 25/0753 (2013.01 - EP); H01L 33/32 (2013.01 - US); H01L 2933/0041 (2013.01 - US); H01L 2933/005 (2013.01 - US); H01L 2933/0058 (2013.01 - EP US); H01L 2933/0066 (2013.01 - US)
Citation (applicant)
- JP 2015032373 A 20150216 - SONY CORP
- JP 2016115703 A 20160623 - CITIZEN ELECTRONICS, et al
Citation (search report)
- [XAYI] US 2014319560 A1 20141030 - TISCHLER MICHAEL A [CA]
- [Y] US 2012257386 A1 20121011 - HARBERS GERARD [US], et al
- [Y] US 2014042467 A1 20140213 - LIVESAY WILLAIM R [US], et al
- [A] WO 2017093248 A1 20170608 - OSRAM OPTO SEMICONDUCTORS GMBH [DE]
- [Y] US 2017092825 A1 20170330 - BANDO YOICHI [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3547377 A1 20191002; EP 3547377 B1 20210630; US 11073725 B2 20210727; US 11886078 B2 20240130; US 2019294004 A1 20190926; US 2021341794 A1 20211104
DOCDB simple family (application)
EP 19165147 A 20190326; US 201916365012 A 20190326; US 202117304548 A 20210622