EP 3547449 A1 20191002 - WIRELESS COMMUNICATION DEVICE INCLUDING A PLURALITY OF HORN ANTENNAS ON A PRINTED CIRCUIT BOARD (PCB), ASSOCIATED MANUFACTURING METHOD AND USE
Title (en)
WIRELESS COMMUNICATION DEVICE INCLUDING A PLURALITY OF HORN ANTENNAS ON A PRINTED CIRCUIT BOARD (PCB), ASSOCIATED MANUFACTURING METHOD AND USE
Title (de)
DRAHTLOSE KOMMUNIKATIONSVORRICHTUNG, DIE EINE MEHRZAHL VON HORNANTENNEN AUF EINER LEITERPLATTE (PCB) UMFASST, ENTSPRECHENDES HERSTELLUNGS- UND VERWENDUNGSVERFAHREN
Title (fr)
DISPOSITIF DE COMMUNICATION SANS FIL INTEGRANT UNE PLURALITE D'ANTENNES-CORNETS SUR UN CIRCUIT IMPRIME (PCB), PROCEDE DE REALISATION ET UTILISATION ASSOCIES
Publication
Application
Priority
FR 1852644 A 20180327
Abstract (en)
[origin: CN110311208A] The invention relates to a wireless communication device integrating a horn antenna on a PCB, a production method and application. The wireless communication device includes: a printed circuit board (PCB) including a dielectric substrate and conductive tracks separated by the dielectric substrate; at least one horn antenna. The horn antenna is a surface mount component (SMC) supported by a PCB substrate and attached to a flange of the PCB substrate. Moreover, the horn antenna is arranged to have a waveguide and a radiation hole on each side of the PCB substrate, and each rib of the horn antenna is in direct contact with or close to the track of the PCB to allow for direct connection or capacitive coupling therebetween.
Abstract (fr)
La présente invention concerne un dispositif de communication sans fil comprenant :- un circuit imprimé (PCB) comprenant un support diélectrique et des pistes électriquement conductrices séparées par le support diélectrique ;- au moins une antenne cornet.L'antenne cornet est un composant monté en surface (CMS) par l'intermédiaire de flasque(s) supporté(s) par le PCB et fixés sur ce dernier, et l'antenne cornet est agencée avec le guide d'onde et l'ouverture rayonnante de part et d'autre du PCB et avec chaque nervure en contact direct ou à proximité d'une piste du PCB, de sorte à permettre une liaison directe ou un couplage capacitif entre eux.
IPC 8 full level
H01Q 13/02 (2006.01); H01P 5/107 (2006.01); H01Q 21/24 (2006.01); H01Q 21/28 (2006.01)
CPC (source: CN EP KR)
H01P 5/107 (2013.01 - EP); H01Q 1/22 (2013.01 - CN KR); H01Q 1/36 (2013.01 - CN); H01Q 1/38 (2013.01 - KR); H01Q 13/02 (2013.01 - KR); H01Q 13/0266 (2013.01 - CN); H01Q 13/0275 (2013.01 - EP); H01Q 13/0283 (2013.01 - CN); H01Q 21/24 (2013.01 - CN EP); H01Q 21/28 (2013.01 - EP)
Citation (search report)
- [XYI] US 4613989 A 19860923 - FENDE JOHN R [US], et al
- [YA] US 2015264515 A1 20150917 - UCHIDA SHIGENORI [JP]
- [YA] US 2017170569 A1 20170615 - ELAD DANNY [IL], et al
- [A] US 5317329 A 19940531 - HATASA TAKESHI [JP]
- [A] US 2008007444 A1 20080110 - MARTINSON GLEN D [CA], et al
- [A] EP 0884854 A2 19981216 - YUPITERU IND CO LTD [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3547449 A1 20191002; EP 3547449 B1 20230607; EP 3547449 C0 20230607; CN 110311208 A 20191008; CN 110311208 B 20210730; ES 2950129 T3 20231005; FR 3079677 A1 20191004; FR 3079677 B1 20211217; KR 102125643 B1 20200622; KR 20190113650 A 20191008
DOCDB simple family (application)
EP 19164351 A 20190321; CN 201910234925 A 20190327; ES 19164351 T 20190321; FR 1852644 A 20180327; KR 20190035216 A 20190327