EP 3551373 A1 20191016 - METHOD FOR THINNING SOLID BODY LAYERS PROVIDED WITH COMPONENTS
Title (en)
METHOD FOR THINNING SOLID BODY LAYERS PROVIDED WITH COMPONENTS
Title (de)
VERFAHREN ZUM DÜNNEN VON MIT BAUTEILEN VERSEHENEN FESTKÖRPERSCHICHTEN
Title (fr)
PROCÉDÉ D'AMINCISSEMENT DE COUCHES DE SOLIDES POURVUES DE COMPOSANTS
Publication
Application
Priority
- DE 102016014821 A 20161212
- DE 102017010284 A 20171107
- EP 2017082468 W 20171212
Abstract (en)
[origin: WO2018108938A1] The present invention relates to a method for separating at least one solid body layer (4) from at least one solid body (1). The method according to the invention includes the following steps: producing a plurality of modifications (9) by means of laser beams in the interior of the solid body (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid body (1), wherein the exposed surface (5) is a part of the solid body layer (4) to be separated; introducing an external force into the solid body (1) in order to create stresses in the solid body (1), wherein the external force is so strong that the stresses cause a crack propagation along the separation plane (8), and wherein the modifications to form the separation plane (8) are produced before producing the composite structure.
IPC 8 full level
B23K 26/36 (2014.01); B23K 26/53 (2014.01); B28D 1/22 (2006.01); H01L 21/302 (2006.01)
CPC (source: EP US)
B23K 26/53 (2015.10 - EP); H01L 21/02354 (2013.01 - US); H01L 21/02422 (2013.01 - US); H01L 21/302 (2013.01 - EP); H01L 21/304 (2013.01 - US); H01L 21/324 (2013.01 - US); H01L 29/66053 (2013.01 - US)
Citation (search report)
See references of WO 2018108938A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2018108938 A1 20180621; EP 3551373 A1 20191016; JP 2020501376 A 20200116; JP 7256123 B2 20230411; US 10978311 B2 20210413; US 2020066542 A1 20200227; US 2021225659 A1 20210722
DOCDB simple family (application)
EP 2017082468 W 20171212; EP 17816734 A 20171212; JP 2019531275 A 20171212; US 201716467765 A 20171212; US 202117207894 A 20210322