Global Patent Index - EP 3552154 A1

EP 3552154 A1 20191016 - SECURE DOCUMENT OR SUPPORT ASSEMBLY

Title (en)

SECURE DOCUMENT OR SUPPORT ASSEMBLY

Title (de)

SICHERE DOKUMENT- ODER STÜTZANORDNUNG

Title (fr)

ASSEMBLAGE SECURISÉ DE DOCUMENT OU DE SUPPORT

Publication

EP 3552154 A1 20191016 (FR)

Application

EP 17821834 A 20171207

Priority

  • EP 16306653 A 20161209
  • EP 2017081907 W 20171207

Abstract (en)

[origin: WO2018104482A1] The invention relates to a method for producing a security document (1), wherein a body (8, 11) is created that comprises two superimposed layers (12, 15), a circuit (13) which is electric and/or has an electronic chip (3) arranged on the interface between said two layers, and a first adhesive (4) between the two layers, which adheres to the two layers and/or the circuit. The method is characterised in that it comprises a step of depositing a second adhesive (5) which is different from, or has a different behaviour from the first adhesive in relation to the solvents or the temperature and partially adheres to at least one of the two layers (12, 15) and/or the circuit (13).

IPC 8 full level

G06K 19/077 (2006.01); G06K 19/073 (2006.01)

CPC (source: EP US)

C09J 9/00 (2013.01 - US); G06K 19/07381 (2013.01 - EP US); G06K 19/0739 (2013.01 - EP US); G06K 19/07722 (2013.01 - EP US); G06K 19/07749 (2013.01 - EP US); G06K 19/0776 (2013.01 - US); G06K 19/07798 (2013.01 - EP US); H01L 23/4985 (2013.01 - US); H01L 23/49855 (2013.01 - US); H01L 23/573 (2013.01 - US); H01L 23/66 (2013.01 - US); H01L 24/29 (2013.01 - US); H01L 24/83 (2013.01 - US); H01L 2223/6677 (2013.01 - US); H01L 2224/29082 (2013.01 - US); H01L 2224/8385 (2013.01 - US)

Citation (search report)

See references of WO 2018104482A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3333778 A1 20180613; EP 3552154 A1 20191016; US 2019311997 A1 20191010; WO 2018104482 A1 20180614

DOCDB simple family (application)

EP 16306653 A 20161209; EP 17821834 A 20171207; EP 2017081907 W 20171207; US 201716466825 A 20171207