EP 3552795 A1 20191016 - SEALING METHOD
Title (en)
SEALING METHOD
Title (de)
DICHTUNGSVERFAHREN
Title (fr)
PROCÉDÉ DE SCELLEMENT
Publication
Application
Priority
- JP 2016240305 A 20161212
- JP 2017044387 W 20171211
Abstract (en)
There is provided a sealing method for sealing an opening of a metallic molded body with a resin molded body. A sealing method for sealing an opening of a metallic molded body with a resin molded body, the metallic molded body having a cavity therein and an opening connected to the cavity, includes a step of irradiating laser light onto a joining surface on a periphery of the opening of the metallic molded body in an energy density of 1 MW/cmor more and at an irradiation rate of 2000 mm/sec or more to roughen the surface, and a step of placing, in a mold, a portion including the joining surface of the metallic molded body roughened in the preceding step and sealing the opening with a resin molded body formed by injection molding or compression molding of a resin. The roughened joining surface of the metallic molded body has a porous structure in which a hole is formed in a range of an average depth of 10 to 70 µm from a surface.
IPC 8 full level
B29C 45/14 (2006.01); B23K 26/354 (2014.01); B29C 43/18 (2006.01)
CPC (source: EP KR US)
B23K 26/00 (2013.01 - EP); B23K 26/352 (2015.10 - EP US); B23K 26/354 (2015.10 - EP); B29C 43/18 (2013.01 - US); B29C 45/14 (2013.01 - EP KR US); B29C 45/14311 (2013.01 - US); B29C 45/14467 (2013.01 - US); B29C 45/14491 (2013.01 - US); B29C 45/26 (2013.01 - KR); B29C 65/70 (2013.01 - KR US); B29D 99/0053 (2013.01 - EP); F16L 47/24 (2013.01 - US); B29C 43/18 (2013.01 - EP); B29C 2045/1454 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3552795 A1 20191016; EP 3552795 A4 20200708; CN 110072684 A 20190730; JP 2018094777 A 20180621; JP 2021169212 A 20211028; JP 7161571 B2 20221026; KR 20190093580 A 20190809; TW 201829149 A 20180816; US 11590608 B2 20230228; US 2020070284 A1 20200305; US 2023166357 A1 20230601; WO 2018110504 A1 20180621
DOCDB simple family (application)
EP 17881870 A 20171211; CN 201780076834 A 20171211; JP 2016240305 A 20161212; JP 2017044387 W 20171211; JP 2021072283 A 20210422; KR 20197016663 A 20171211; TW 106143480 A 20171212; US 201716465908 A 20171211; US 202318161432 A 20230130